Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Process for manufacturing conductive circuit

A conductive circuit and process technology, which is applied in the field of silk screen flexible circuits, can solve the problems of insufficient bonding strength, high cost of silk screen lines, single material selection, etc., and achieve the effect of free material selection, low cost, and high product transparency

Pending Publication Date: 2022-08-05
HUIZHOU DINGFENGTAI TECH
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a process for manufacturing conductive lines to solve the technical problems of high cost of silk screen lines in the prior art, insufficient bonding strength, and single material selection.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Process for manufacturing conductive circuit
  • Process for manufacturing conductive circuit
  • Process for manufacturing conductive circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Back, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Countercl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a process for manufacturing a conductive circuit. The process comprises the following steps: S1, combining a base material layer material and a protective layer material which are prepared in advance through a compounding process; s2, performing die cutting on the substrate layer by using a die cutting process to form a parting line of a circuit area and a non-circuit area; s3, performing vacuum plating of a metal layer on the whole base material layer by using a vacuum plating process; s4, removing the unwanted metal layer in the base material layer, and reserving the required metal layer; and S5, covering the base material layer attached with the metal layer with another protective layer. The technical problems that in the prior art, a silk-screen circuit is high in use cost, insufficient in bonding strength and single in selected material are solved.

Description

technical field [0001] The invention relates to the technical field of silk-screen flexible circuits, in particular to a process for manufacturing conductive circuits. Background technique [0002] Flexible circuit boards are often used as basic accessories for various electronic devices. The manufacturing method of the flexible circuit board in the prior art is complicated, which requires many processes such as copper sinking and etching. As a result, the existing flexible circuit board has the defect of low production efficiency. In addition, the existing process also has technical problems such as the high manufacturing cost of the flexible circuit board and the difficulty in controlling the manufacturing process of the flexible circuit board. Based on this, Chinese patent CN111867265A discloses a manufacturing method of a flexible circuit board, which includes the following steps: providing a flexible substrate, flexible silver paste and a screen printing device, and u...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/28
CPCH05K3/02H05K3/285
Inventor 林卓奇林卓群
Owner HUIZHOU DINGFENGTAI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com