Computer hardware auxiliary machining equipment capable of improving tin soldering effect

Abstract

The invention relates to the technical field of computer hardware machining, in particular to computer hardware auxiliary machining equipment capable of improving the tin soldering effect, which comprises a bottom plate, at least two guide mechanisms are arranged on the upper end surface of the bottom plate, and the guide mechanisms are equidistantly arranged in the front-back direction; the guide mechanism comprises a shell and a plurality of connecting shells perpendicularly and fixedly connected to the outer surface of one side of the shell, the outer surface of the other side of the shell is movably matched with the bottom plate in an inserted mode, the outer surfaces of the connecting shells are provided with feeding parts allowing solder paste to be filled in, and the connecting shells are arranged at equal intervals in the vertical direction. The connecting shell extends in the front-back direction, through holes are separately formed in the front end face and the rear end face of the connecting shell, and the front through hole and the rear through hole are coaxial, the tin injection device can be applied to tin injection of heat dissipation pipe and heat dissipation fin holes, the tin injection efficiency is remarkably improved, the tin injection effect is uniform, and the tin injection process is rapid and convenient.

Description

technical field [0001] The invention relates to the technical field of computer hardware processing, in particular to a computer hardware auxiliary processing device that can improve the soldering effect. Background technique [0002] There are many types of computer hardware. From the appearance point of view, a microcomputer consists of a main chassis and external devices. The main chassis mainly includes CPU, memory, motherboard, hard disk drive, optical disk drive, various expansion cards, connecting cables, power supplies, etc.; external devices Including mouse, keyboard, etc. [0003] Computer cpu radiator is also one of the common hardware. In the process of processing, after the heat sink and the heat pipe are inserted into each other on the fixture, solder paste needs to be injected into the pores of the connection, and the amount of solder paste injected needs to be To be more precise, if the amount of solder paste is too much, it will cause a problem of large the...

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Problems solved by technology

[0003] The computer cpu heat sink is also one of the common hardware. In the process of processing, after the heat sink and the heat pipe are inserted into each other on the jig, solder paste needs to be injected into the pores of the connection, and the amount of solder paste injected needs to be determined. To be more precise, if the amount of solder paste is too much, it will cause a problem of high thermal resistance. If the amount of solder paste is too small, it will cause poor contact and fail to achieve the effect of assembly reinforcement. After injecting solder paste, it will be sent to the reflow furnace through the conveyor line Internal heat treatment; and the process of tin injection is quite inconvenient. Usually, workers inject tin into the pores group by group. There are many repetitive actions and waste of time. The amount of tin injection is all based on experience, and the amount of tin at each position in the pores is also difficult. To achieve balance and unity, in the whole heat sink processing process, the tin injection process needs to be improved by designing an auxiliary processing equipment

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