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Crimping type IGBT (Insulated Gate Bipolar Translator) module packaging device

A module packaging and crimping technology, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of cumbersome operation, inconvenient maintenance of IGBT sub-modules or IGBT modules, and inconvenient wiring of terminal blocks. To achieve the effect of convenient installation and disassembly, convenient wiring and dismantling

Active Publication Date: 2022-08-09
YANTAI TAIXIN ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to fix the casing of the existing IGBT module package proposed in the background technology by welding, which reduces the installation efficiency of the package structure and is not convenient for the internal parts of the package structure. IGBT sub-modules or IGBT modules are overhauled, and the terminals are not convenient for wiring, and the operation is cumbersome. A packaging structure for IGBT modules that is convenient for disassembly and assembly of the housing and wiring is proposed.

Method used

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  • Crimping type IGBT (Insulated Gate Bipolar Translator) module packaging device
  • Crimping type IGBT (Insulated Gate Bipolar Translator) module packaging device
  • Crimping type IGBT (Insulated Gate Bipolar Translator) module packaging device

Examples

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Embodiment 1

[0028] Example 1, as Figure 1-Figure 6 As shown, a crimping IGBT module packaging device proposed by the present invention includes a substrate 1, an IGBT sub-module is arranged on the upper side of the substrate 1, and an outer casing 2 that can cover the IGBT sub-module is mounted on the substrate 1. The outer casing The lower side of 2 is fixed with a circular frame block 22, and the upper side of the base plate 1 is provided with a circular frame slot 21 which is adapted to the circular frame block 22. The position of 2 is positioned, and at the same time, the sealing between the casing 2 and the substrate 1 is increased. The IGBT sub-module is provided with a conductive terminal 11 for energization. The conductive terminal 11 is made of hard conductive material, and both sides of the casing 2 are fixed. There is a pressing plate 23, and a pressing and fixing mechanism 3 capable of pressing and fixing the pressing plate 23 is installed on the base plate 1;

[0029] The p...

Embodiment 2

[0034] Example 2, as figure 1 , figure 2 as well as Figure 7 As shown, in a crimping IGBT module packaging device proposed by the present invention, compared with the first embodiment, a wiring mechanism 4 corresponding to the conductive terminals 11 is fixed on the upper side of the casing 2 in this embodiment. The mounting block 41 at the upper end of the housing 2 is provided with two inner holes 42 for inserting wires on one side of the mounting block 41 , and an inserting through hole communicating with the interior of the casing 2 is formed on the lower side of the inner hole 42 for the inserting wire, and the inserting through holes are connected with the conductive terminals 11 The upper end of the conductive terminal 11 can be inserted into the insertion through hole, and the lower side of the inner hole 42 of the plug-in wire is connected with a receiving groove 43. The receiving groove 43 is provided with a conductive extrusion arc plate 44. The conductive extrus...

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Abstract

The invention relates to the technical field of IGBT module packaging, in particular to a crimping type IGBT module packaging device. According to the technical scheme, the IGBT module comprises a substrate, an IGBT sub-module is arranged on the upper side of the substrate, a shell capable of covering the IGBT sub-module is installed on the substrate, a conductive terminal used for electrification is arranged on the IGBT sub-module, pressing plates are fixed to the two sides of the shell, and an extrusion fixing mechanism capable of fixing the pressing plates is installed on the substrate; the extrusion fixing mechanism comprises a long shell fixed to the upper side of the base plate, a sliding push rod is arranged in the extrusion fixing mechanism in a sliding mode, a limiting piece for limiting movement of the sliding push rod in one direction is arranged in the long shell, and the sliding push rod can extrude and fix the pressing plate when moving towards one side. According to the invention, the housing can be conveniently mounted and dismounted, wiring and wire dismounting can be conveniently carried out, and convenience is brought to maintenance of operators.

Description

technical field [0001] The invention relates to the technical field of IGBT module packaging, in particular to a crimping type IGBT module packaging device. Background technique [0002] IGBT, Insulated Gate Bipolar Transistor, is a composite fully controlled voltage-driven power semiconductor device composed of BJT (Bipolar Transistor) and MOS (Insulated Gate Field Effect Transistor), with high input impedance of MOSFET and GTR The two advantages of low on-voltage drop, GTR saturation voltage is reduced, the current carrying density is large, but the driving current is large, the MOSFET driving power is small, the switching speed is fast, but the on-voltage drop is large, the current carrying density is small, and the IGBT Combining the advantages of the above two devices, the driving power is small and the saturation voltage is reduced. The Chinese invention patent with the authorization announcement number CN111128981B discloses an IGBT module packaging structure and pack...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/10H01L23/49
CPCH01L23/10H01L23/49
Inventor 姜维宾郭家良
Owner YANTAI TAIXIN ELECTRONICS TECH CO LTD
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