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Superposed processing method for wood fibre board

A technology of wood fiber board and processing method, which is applied in the direction of wood processing equipment, wooden veneer joint, manufacturing tools, etc., and can solve the problems of wood cracking, expansion, and unusable MDF boards, etc.

Inactive Publication Date: 2004-08-25
SHINSEIKAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, it has the following disadvantages, that is, due to the manufacturing method of hot pressing, the material and specific gravity of the surface of the material and the central part are different, and when the surface is coated, the permeability of the slippery surface to the coating material is not good. Evenly, 3 to 6 months after coating, tiny unevenness will appear on the surface of the coating
[0006] In addition, the above-mentioned MDF boards have problems of swelling, deformation, and cracking of wood mouths due to water absorption.
[0007] In addition, the above-mentioned MDF board cannot be used for applications that must require more than the specified strength, and its thickness can only be 40n
Left and right, cannot be used for thick products
[0008] In addition, it is also impossible to manufacture products of various sizes or shapes, such as products with curved surfaces and products with a certain strength even if they are thinner.

Method used

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  • Superposed processing method for wood fibre board
  • Superposed processing method for wood fibre board
  • Superposed processing method for wood fibre board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0039] figure 1 It is an embodiment in which a plurality of wood fiber boards 1 are stacked horizontally.

no. 2 Embodiment

[0041] figure 2 This is an example in which a product in which wood fiber boards 1 are stacked in the horizontal direction and a product in which water quality fiber boards 1 are stacked in the vertical direction are bonded to the side.

no. 3 Embodiment

[0043] image 3 This is an embodiment in which a product in which wood fiber boards 1 are stacked in the horizontal direction and a product in which wood fiber boards 1 are stacked in the vertical direction are integrally bonded up and down. This embodiment is formed of 3 layers.

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Abstract

Method for laminating woody fiberboards, the laminated woody fiberboards product is processed into a prescribed shape and the strength of the processed article is increased, so as to complete the product. The method comprises the steps of: molding wood chips using an adhesive as a binder, to produce a woody fiberboard having a prescribed thickness; impregnating or coating a single board of the woody fiber board with a polyurethane primer, followed by drying; laminating two or more of the fiberboards with an adhesive; processing the laminated fiberboard product by cutting into a prescribed shape; impregnating or coating the processed article with a polyurethane primer followed by drying; and impregnating or coating the dried article with one or more of a urethane, a melamine, or a polyester resin and a lacquer, to finish the product.

Description

technical field [0001] The present invention relates to the stacking process of wood fiber boards for various purposes. Background technique [0002] In the past, wood fiber boards, namely MDF boards (medium fiberboards), which were formed by processing fibers that cracked wood chips into fine flocs and binders by hot pressing, were lighter and had higher strength or water resistance. , so that it can be used as various building materials, furniture, wash-face dressing table or kitchen equipment and other near-water products. [0003] Since the above-mentioned MDF has the excellent feature of being able to use juvenile wood or thinned wood as raw materials, when considering the effective use of forest resources, or the depletion of the world's forest resources and other global environmental issues, the MDF board has become the world's most Up-and-coming new base material. [0004] In addition, it also has the following excellent characteristics, that is, it avoids warping,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B27D5/00B27D1/04B27K3/50B27N3/00B27N3/04
CPCB27N3/00Y10T156/1052
Inventor 今道弘今正尊
Owner SHINSEIKAN
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