Unlock instant, AI-driven research and patent intelligence for your innovation.

Parts mounting baseplate and making method therefor

A component mounting and bottom plate technology, which is applied in the fields of printed circuit manufacturing, printed circuit parts, printed circuit assembly of electrical components, etc., can solve problems such as heat generation, smoke and fire, and damaged connection reliability of welding parts

Inactive Publication Date: 2005-01-05
KK TOSHIBA
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Once peeling occurs, the connection reliability of the soldered part is impaired
In addition, if a large current flows through the welded part where peeling occurs, heat will be generated, and even smoke and fire will be generated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Parts mounting baseplate and making method therefor
  • Parts mounting baseplate and making method therefor
  • Parts mounting baseplate and making method therefor

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0034] figure 1 It shows the state where the electronic component 22 is soldered to the printed wiring board 21 constituting the wiring board using lead-free solder 23 . figure 1 Among them, the substrate 24 of the printed wiring board 21 is made of glass fiber reinforced plastics, and the front and back of the substrate are provided with copper conductor patterns 25, 25, and a protective film 26 is provided to prevent solder from adhering to the conductor patterns 25.

[0035] A lead insertion hole 27 is formed on the printed circuit board 21 for inserting the lead wire 22a of the aforementioned electronic component 22 , and two conductor insertion holes 28 are provided near the insertion hole 27 . The lead wire insertion holes 27 and the conductor insertion holes 28 are each formed of through holes, and the inner peripheral surface of each hole is provided with a connection pattern 25a for electrically connecting the conductor patterns 25, 25 on the upper and lower sides o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An parts installation bottom and its manufacturing method. At the time of soldering the electronic parts 22 to the printed wiring board 21 by using the lead-free solder 23, conductor inserting holes 28 are made parts 22 are inserted. In addition, auxiliary conductors 30 which electrically connect conductor patterns 25 and 25 to each other are provided in the holes 28. Even when lift-off phenomena occur on the upper surface sides of the portions to which the leads 22a of the parts 22 are soldered, the auxiliary conductors 30 can supplement the electrical connection between the conductor patterns 25 and 25. The present invention improves the reliability of soldered connections at the time of soldering by using lead-free solder.

Description

technical field [0001] The invention relates to a component mounting base plate for soldering electronic parts to a circuit board with conductor patterns on both sides with lead-free solder and a manufacturing method thereof. Background technique [0002] In the past, when soldering electronic components to a printed circuit board as a circuit board, based on the viewpoint of ease of manufacture and reliability, eutectic solder of lead-tin alloy was used. The eutectic solder was 63% (weight) of tin and 63% of lead. 37% by weight. However, when the product is discarded, the mounting base of the parts soldered with eutectic solder is generally disposed of in a landfill. In recent years, it has been found that due to acid rain in landfills, lead in eutectic solder is dissolved, causing environmental problems. [0003] In order to solve this environmental problem, research and development of lead-free solders have become popular in recent years, and lead-free solders are gener...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/34H05K13/00
CPCH05K1/184H05K3/3447
Inventor 青木政幸
Owner KK TOSHIBA