Mother electric device, its producing method and electronic device and its producing device

Abstract

An electronic device such as a semiconductor device, a method of manufacturing the same, and an apparatus for manufacturing the same, wherein by placing a ceramic substrate (32) provided with a metallic thin film (2) integrated into at least one selected from an upper surface and a lower surface of the ceramic substrate (32) in its peripheral portion so as to extend both inside and outside a cavity (38) of a mold for transfer molding, and positioning the metallic thin film (2) in a position with which an upper mold (30) and a lower mold (31) of the mold come into contact, occurrence of cracks or breakage in the ceramic substrate is prevented by buffering the pressure applied to the ceramic substrate so as to prevent a distortion force from being caused even when the ceramic substrate is sandwiched and compressed between the upper mold and the lower mold.

Description

technical field [0001] The present invention relates to an electronic device, a manufacturing method thereof, and a manufacturing device thereof, for example, an electronic device related to a semiconductor device such as a leadless small surface mount type transistor or a diode, a manufacturing method thereof, and a manufacturing device thereof. Background technique [0002] 9A to 9C show structural examples of conventional leadless small surface-mount transistors. That is, FIG. 9A is a plan view of a conventional leadless small surface mount transistor, FIG. 9B is a perspective side view of FIG. 9A, and FIG. 9C is a bottom view of FIG. 9A. [0003] As shown in FIGS. 9A to 9B , the leadless small surface-mount electronic device 3 has: a first upper electrode 11 having an element placement portion on an upper surface 321 of a ceramic substrate 32; and a second upper electrode 12 and a second upper electrode 11. 3. The upper electrode 13 is arranged separately from the first...

AI Technical Summary

Problems solved by technology

[0016] In addition, even in the dicing process for forming individual packages, it is difficult to attach the electronic device to the tape for fixing the resin surface due to the unevenness d1 and d2 on the surface of the electronic device after the resin has hardened. There is also the problem that the above-mentioned electronic devices that are cut into individual pieces when cutting are separated from the fixing band and are easily lost.

[0017] In addition, since ceramic substrates are difficult to bend compared to other resin substrates or metal lead frames, cracks are likely to occur in ceramic substrates due to deformation caused by pressure applied when clamping the ceramic substrates with upper and lower metal molds or cracks, so in the conventional non-lead small surface mount type transistors, resin encapsulation by the transfer molding method using the metal mold known so far as the encapsulation method of semiconductors has not been adopted.

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