Plane mounting circuit module

Abstract

Provided is a surface-mounted circuit module. In the surface-mounted circuit module, a circuit board 1 has a plurality of cutouts formed in an insulation thin plate in a first layer located on the lowest surface, and a plurality of electrodes located on the bottom surface of an insulation thin plate located in a second layer from the lowest surface. The electrodes are located inside the cutouts. The cutouts are so formed as to reach a side face of the insulation thin plate in the first layer, the electrodes are exposed through a side face of the insulation thin plate in the first layer, and hence a gap between the electrodes and the upper surface of a mother board is the same as the thickness of the insulation thin plate in the first layer and is relatively large. Due to this structure, a state of soldering for connecting the electrodes and a wiring pattern can be visually inspected easily from the side through the cutouts.

Description

technical field [0001] The present invention relates to a surface mount type circuit module used in electronic devices such as short-distance wireless telephones and mobile phones. Background technique [0002] If according to Figure 7 The structure of a conventional surface-mount type circuit module will be described. The circuit board 51 is formed by laminating multiple layers of insulating thin plates 52 , 53 , and 54 . [0003] In addition, a plurality of electrodes 55 are formed on the lower surface of the first layer of insulating sheet 52 located at the bottom; between the first layer of insulating sheet 52 and the insulating sheet 53 located at the second layer from the bottom, a wiring pattern is provided. 56; between the second-layer insulating sheet 53 and the uppermost third-layer insulating sheet 54, a wiring pattern 57 is arranged; and, a wiring pattern 58 is formed on the upper surface of the uppermost third-layer insulating sheet 54 . [0004] In addition,...

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Problems solved by technology

[0008] In the existing circuit module, the electrode 55 arranged on the bottom of the first insulating sheet 52 and the wiring pattern 62 arranged on the mother board 61 are welded by solder 63. Therefore, the gap between the electrode 55 and the wiring pattern 62 Since it is very small, when visually inspecting the state of the solder 63 provided to connect the two from the side, it is difficult to see the soldering state of the solder 63, and it is difficult to perform a visual inspection, and there is a problem that inspection is laborious.

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