High capacity memory module with built-in high speed bus terminations

Abstract

A memory module (24) for use in conjunction with high speed, impedance-controlled buses. Each memory card (12) may be a conventional printed circuit card (12) with memory chips (28) attached directly to the card (12). Alternately, high density memory modules (24, 35, 38) assembled from pluggable sub-modules (24, 35, 38) may be used. These sub-modules (24, 35, 38) may be temporarily assembled for testing and / or burn-in. Bus terminations (52) mounted directly on the memory card (12) or the memory module (24, 35, 38) eliminate the need for bus exit (42) connection, allowing the freed up connection capacity to be used.

Description

[0001] Related Patent Applications [0002] This application and the U.S. Patent No. 5,928,005 issued to Li et al., the invention title is "Self-Assembled Low Insertion Force Connector Assembly (Self-Assembled Low Insertion Force Connector Assembly)", and it was filed at the same time and jointly with this application. Pending US Patent Application No. _____ [HCD-201] is related to US Patent Application No. _____ [HCD-102], all of which are hereby incorporated by reference. technical field [0003] The present invention relates to a high-density memory module for various computer applications, especially a high-density memory module with a built-in impedance-controlled transmission line bus and a selective built-in driver line terminal. Background of the invention [0004] Modern high-speed digital computers and the complex software that executes on them place increasing demands on volatile random access memory (RAM). As the bus and clock rates increase, the electrical driv...

AI Technical Summary

Problems solved by technology

If known connectors are used on one module, two memory channels can be combined on one module, increasing the bandwidth and doubling the memory capacity

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