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Process for application of powder coatings to non-metallic substrates

A technology of powder coating and conductive base material, which is applied in metal material coating process, heating inorganic powder coating, pressure inorganic powder coating, etc. It can solve the problems of insufficient coverage of plates and heat loss, etc.

Inactive Publication Date: 2006-04-12
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that the edges of the sheet are often not adequately covered due to heat loss

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A 6mm thick MDF board was treated by passing it through a chamber in which the board was exposed to steam and circulating air heated to 80°C for 1 minute. After removal from the chamber, the panels were left to stabilize for 1 minute before being applied with a powder coating using a conventional high voltage electrostatic spray gun. The powder coating works really well, including completely covering the edge of the board and wrapping around the back of the board.

Embodiment 2

[0034] Another identical panel was coated in the same way, but without the steam-heat treatment step. Powder coating is less effective, in particular it is impossible to reach the edges of the covered sheet, and winding around is limited.

Embodiment 3

[0036] Another identical plate was preheated by infrared radiation to a surface temperature of 80 °C, and then powder coated as described above within 1 min. Powder did not bond to the edge of the board.

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Abstract

The present invention describes a process for the application of a powder coating to a non-conductive substrate by first exposing the non-conductive substrate to a combination of steam and heat at temperatures between 70 DEG C and 140 DEG C for a period between 5 seconds and up to 10 minutes, followed by electrostatic application of a powder coating to the substrate which is grounded; this simple and reliable pre-treatment method allows an efficient application of powder coatings to non-conductive substrates resulting in uniform and even deposition of the powder coating over the whole surface including edges and with no adverse effects on the subsequent curing of the powder film.

Description

Background of the invention [0001] The present invention relates to a method of applying powder coatings to non-metallic substrates such as wood or plastics, gypsum and cement based products, and composite materials, preferably medium density fiberboard (MDF) or other cellulose based substrates. [0002] Powder coatings are typically applied to conductive metal substrates, the deposition of powder coatings on these conductive materials being enhanced by electrostatic forces. The powder is charged by friction (tribocharging) or corona discharge, and the charged powder is sprayed onto a grounded substrate. The electrostatic charge on the powder coating particles causes a uniform powder layer to be applied to the substrate and also causes the powder to temporarily stick to the surface of the substrate. The bond is so strong that the coated sheet can be transported from where the powder is applied to a curing oven where it melts the powder and forms a continuous film on the subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D1/06B05D1/04B05D3/00B05D3/02B05D7/24C23C4/02C23C24/04C23C24/08C23C24/10
CPCC23C24/04C23C24/10B05D1/045C23C4/02C23C24/08B05B5/032B05B7/22
Inventor M·L·霍利迪C·威尔逊C·G·皮尔斯
Owner EI DU PONT DE NEMOURS & CO