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Process for preparing super fine tunsten-copper composite powder

A technology of composite powder and copper solution, which is applied in the direction of coating, etc., can solve the problems of difficult precise control of the ratio of tungsten and copper, the decline of material comprehensive performance, long time and other problems, and achieve short production cycle, low oxygen content and low energy consumption Effect

Inactive Publication Date: 2006-05-03
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the uneven distribution of tungsten phase and copper phase in the prior art, the ratio of tungsten and copper in the composite powder is difficult to be accurately controlled, copper leakage is easy to occur in the process of making devices, high temperature, long time, and the overall performance of the material decline Weaknesses, the present invention proposes a method for preparing ultrafine tungsten-copper composite powder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Prepare 93.7 g of tungsten-copper composite powder with a copper content of 4%.

[0015] Copper sulfate (CuSO 4 ·H 2 (2) 15.0g and complexing agent (potassium sodium tartrate 8.0g, ethylenediaminetetraacetic acid disodium salt 36.0g) are dissolved with 500mL deionized water respectively (if necessary, filter to remove impurities), then copper sulfate solution and complexing agent The solution was simultaneously added to a 2500mL reactor equipped with a stirring and heating device for mixing, and the pH value was adjusted to 12 with NaOH solution. The stabilizer (potassium ferrocyanide 0.015g, α,α-bipyridine 0.03g) was also dissolved in deionized water, and the dispersant was added to the solution, and then deionized water was added until the total volume of the solution was 2000mL. Copper sulfate (CuSO 4 ·H 2 O) a solution with a concentration of 7.5g / L; turn on the stirring device, and heat up to 40°C, add 16mL of formaldehyde (37%) and 90.0g of tungsten powder (ab...

Embodiment 2

[0018] Ketone sulfate (CuSO 4 ·5H 2 (2) 40.0g and complexing agent (potassium sodium tartrate 24.0g, ethylenediaminetetraacetic acid disodium salt 40.0g) are dissolved with 800mL deionized water respectively (if necessary, filter to remove impurities), then copper sulfate solution and complexing agent The solution was simultaneously added to a 2500mL reactor equipped with a stirring and heating device for mixing, and the pH value was adjusted to 13 with NaOH solution. Dissolve the stabilizer (potassium ferrocyanide 0.04g, α,α-bipyridine 0.03g) with an appropriate amount of deionized water, and add the dispersant to the above solution, and then add deionized water until the total volume of the solution is 2000mL , to get copper sulfate (CuSO 4 ·H 2 O) A solution with a concentration of 20.0g / L; turn on the stirring device, and heat up to 60°C, add 20mL of formaldehyde (37%) under stirring, slowly add 40.0g of tungsten powder (particle size is about 1 micron), and control the...

Embodiment 3

[0021] Copper sulfate (CuSO 4 ·5H 2 (2) 20.0g and complexing agent (potassium sodium tartrate 14.0g, ethylenediaminetetraacetic acid disodium salt 25.0g) are dissolved with 500mL deionized water respectively (if necessary, filter to remove impurities), then copper sulfate solution and complexing agent The solution was simultaneously added to a 2500mL reactor equipped with a stirring and heating device for mixing, and the pH value was adjusted to 12.5 with NaOH solution. Dissolve the stabilizer (potassium ferrocyanide 0.02g, α,α-bipyridine 0.01g) with an appropriate amount of deionized water, add the dispersant to the above solution, and then add deionized water until the total volume of the solution is 2000mL , to get copper sulfate (CuSO 4 ·H 2 O) A solution with a concentration of 10.0g / L; turn on the stirring device, and heat up to 50°C, add 15mL of formaldehyde (37%) under stirring, slowly add 45.0g of tungsten powder (particle size is about 1 micron), and control the t...

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Abstract

The invention provides a preparation method of ultrafine tungsten-copper composite powder. In order to improve the uniformity of the tungsten-copper composite powder and the comprehensive performance of the material, and to solve the problem of the stability of the copper component in the sintering process of the powder, the present invention adopts the liquid phase chemical deposition method, and utilizes the liquid phase chemical deposition copper solution in the reaction Dynamic production is carried out in the device, and a dispersant is added to the liquid phase chemical deposition copper solution to eliminate the electrostatic attraction between solid particles, so that the copper phase is evenly deposited on the surface of the ultrafine metal tungsten particles, and the copper phase is basically covered Ultrafine tungsten-copper composite powder composed of monodisperse particles with tungsten phase. The ultra-fine tungsten-copper composite powder prepared by the present invention has the characteristics of low energy consumption, short production cycle, high purity of tungsten-copper composite powder, low oxygen content, no copper leakage phenomenon and uniform structure during sintering molding, and can be processed by High-pressure injection molding and sintering to make tungsten-copper pseudo-alloy devices, and then obtain a composite material with high density, high thermal conductivity, high electrical conductivity and low expansion coefficient, which can be applied to packaging materials for computer chips, high-precision instruments, and equipment. Heat dissipation materials, high-precision and high-density weight materials.

Description

(1) Technical field: [0001] The invention relates to a preparation method of ultrafine tungsten-copper composite powder in the field of metal materials. (two) background technology: [0002] Tungsten-copper pseudoalloy has the characteristics of high temperature resistance, high hardness, low expansion coefficient, high thermal conductivity and good plasticity of tungsten and copper, and has wide application. The main manufacturing methods of devices composed of tungsten-copper pseudoalloys include: porous tungsten skeleton infiltrated with liquid copper, thermal compression of tungsten-copper composite powder, including liquid phase sintering, recompression, explosive compression and other technologies. Complicated shapes can be made by injection molding tungsten-copper composite powder. It would be ideal to be able to fabricate devices using tungsten-copper pseudoalloys at or near theoretical densities. In addition to the improvement of mechanical properties, increasing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/24B22F1/02
Inventor 黄卫东宋宝兴刘建睿王猛林鑫
Owner NORTHWESTERN POLYTECHNICAL UNIV
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