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Silver-palladium alloy powder for conductive composition and preparation method of silver-palladium alloy powder

A technology of conductive composition and silver-palladium alloy, applied in the field of silver-palladium alloy powder for conductive composition and preparation thereof, can solve the problems of large pollution, uncontrollable degree of alloying, and inability to fully apply solderable conductive composition and the like

Active Publication Date: 2020-01-21
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the process of preparing silver-palladium alloy powder by chemical method is complicated, the pollution is large, the particle size is not easy to control, and the degree of alloying cannot be controlled.

Method used

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  • Silver-palladium alloy powder for conductive composition and preparation method of silver-palladium alloy powder
  • Silver-palladium alloy powder for conductive composition and preparation method of silver-palladium alloy powder
  • Silver-palladium alloy powder for conductive composition and preparation method of silver-palladium alloy powder

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preparation example Construction

[0033] The method for preparing the silver-palladium alloy powder of the present invention comprises making the mixture of the silver powder and the palladium powder undergo a solid-phase reaction. In this article, solid-phase reaction refers to the process of solid-solid reaction to generate new solid-phase products, which can also be called solid-phase alloy reaction and sintering reaction.

[0034] The solid-phase reaction of the present invention can be carried out using conventional equipment, for example, various temperature-controlled and pressure-controlled sintering equipment, such as a gas pressure sintering furnace, can be used.

[0035] In the present invention, the solid-phase reaction is carried out in a low temperature and high pressure environment. The temperature of the solid-phase reaction is preferably 250°C to 300°C, for example, within the range defined by any two temperature values ​​selected from 250°C, 260°C, 270°C, 280°C, 290°C and 300°C as endpoints, ...

Embodiment 1

[0079] The silver-palladium alloy powder used in the present embodiment is prepared by the following method:

[0080] Silver powder with a particle size of 1.7μm to 2μm and a specific surface area of ​​5m 2 / g~8m 2 The palladium powder of / g is weighed according to the ratio of 99:1, mixed with a mixer, put into a ceramic crucible, put into a pressure sintering furnace, set the pressure in the furnace to 1MPa, the temperature of 250 ° C, and the holding time of 2 hours , the heating rate is 20°C / min.

[0081] Other raw materials used in this example are as follows:

[0082] Silver powder: particle size 1.7μm ~ 2μm;

[0083] Palladium powder: specific surface area is 5m 2 / g~8m 2 / g;

[0084] Glass powder: lead-free glass powder F-643;

[0085] Oxides: bismuth oxide and copper oxide;

[0086] Organic carrier: ethyl cellulose 5%, terpineol 95%.

[0087] The material ratio and performance of the conductive composition of Example 1 are shown in Table 1 and Table 2, respec...

Embodiment 2

[0093] The silver-palladium alloy powder used in this example is prepared by the following method: silver powder with a particle size of 1.7 μm to 2 μm and a specific surface area of ​​5 m 2 / g~8m 2 The palladium powder of / g is weighed according to the ratio of 97:3, mixed with a mixer, put into a ceramic crucible, put into a pressure sintering furnace, set the pressure in the furnace to 1MPa, the temperature of 250 ° C, and the holding time of 3 hours , the heating rate is 20°C / min.

[0094] Other raw materials used in this example are as follows:

[0095] Silver powder: particle size 1.7μm ~ 2μm;

[0096] Palladium powder: specific surface area 5m 2 / g~8m 2 / g;

[0097] Glass powder: lead-free glass powder F-643;

[0098] Oxides: bismuth oxide and copper oxide;

[0099] Organic vehicle: ethyl cellulose: terpineol = 5:95.

[0100] The material ratio and performance of the conductive composition of Example 2 are shown in Table 3 and Table 4, respectively. The conduct...

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Abstract

The invention discloses silver-palladium alloy powder for a conductive composition and a preparation method of the silver-palladium alloy powder. After silver powder and palladium powder are evenly mixed physically, a solid phase alloy reaction is carried out in low-temperature and high-pressure environments, and therefore the silver-palladium alloy powder is obtained. The silver-palladium alloy powder can be directly applied to the conductive composition, and the reliability indexes such as the welding resistance and the aging tension of the conductive composition can be effectively improved.Compared with the prior art, the silver-palladium alloy powder for the conductive composition and the preparation method of the silver-palladium alloy powder have the beneficial effects that the operation is easy, environmental pollution is low, the silver-palladium ratio is accurate, convenience is achieved, and the granularity of the powder is controllable, and the prepared silver-palladium alloy powder can be directly applied to thick film electronic paste.

Description

technical field [0001] The invention belongs to the field of conductive materials, and particularly relates to a silver-palladium alloy powder for a conductive composition and a preparation method thereof. Background technique [0002] Precious metals such as silver and palladium and their alloy powders have many important applications. Especially in the electronics industry, when preparing thick-film integrated circuits, precious metals such as silver and palladium and their alloy powders are widely used as conductor pastes for wire connection. Thick-film integrated circuits refer to integrated circuits formed by using silk-film processes (screen printing, sintering and electroplating, etc.) to fabricate passive networks on the same substrate and assemble discrete semiconductor devices, monolithic integrated circuits or micro-components. It is generally considered that a film with a thickness of several micrometers to several tens of micrometers is a thick film. Because t...

Claims

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Application Information

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IPC IPC(8): C22C1/04C22C5/06B22F1/00H01B1/16H05K1/09
CPCB22F1/0003C22C1/0466C22C5/06H01B1/16H05K1/092
Inventor 鹿宁陆冬梅周宝荣薛韩英王要东赵科良兰金鹏
Owner 西安宏星电子浆料科技股份有限公司
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