Surface conducting electronic emitting component and mfg. method for image forming device
A technology of electron emission and manufacturing method, which is applied in the manufacture of discharge tubes/lamps, electrical components, electrode systems, etc., and can solve problems such as increased complexity, high-cost manufacturing, and difficulty in controlling the shape of components and uniformity of film thickness
Inactive Publication Date: 2006-12-20
CANON KK
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] In the existing manufacturing method of the surface conduction electron emission element with the above-mentioned structure, in the method of forming a conductive thin film using vacuum evaporation technology or photolithography technology, even if a plurality of surface conduction electron emission elements can be formed over a large area, components, there is also the need for special and expensive manufacturing equipment, and the problem of high production costs
[0006] In addition, even if the inkjet method is used, there is a limitation corresponding to high definition, and when forming a surface conduction electron emission element on a large screen, the complexity increases, and there is a disadvantage that it is difficult to control the shape of the element and the uniformity of the film thickness.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0084] The surface conduction electron emitting element of the type shown in Figures 1A and 1B is composed of Figure 4-8 Made in the order shown.
[0085] In Figures 1A and 1B, 1 is the substrate, 2 and 3 are the element electrodes, 4 is the conductive film, 5 is the electron emission part, L is the interval between the element electrodes 2 and 3, and W is the opposite of the element electrodes 2, 3 The width of the setting, W′ represents the width of the conductive film 4. In addition, in Figure 4-8 Among them, 1 is a substrate, 2 and 3 are element electrodes, 4 is a conductive film, 6 is a Y-direction wiring, 7 is an interlayer insulating layer, 8 is a contact hole, 9 is a X-direction wiring, and the conductive film 4 contains electron emission Part (in Figure 8 Not drawn in).
[0086] Below, using Figures 1A, 1B and Figure 4-8 The method of manufacturing the surface conduction electron emitting element of this embodiment will be described.
[0087] (A) Formation of element ele...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| particle diameter | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| width | aaaaa | aaaaa |
Login to View More
Abstract
An ion-exchangeable resin pattern is formed on a substrate 1, and after making the resin pattern part absorb a solution containing a metal component by ion exchange reaction, a conductive thin film 4 is formed by baking the resin pattern. This surface conduction type electron emission element is manufactured by a process to apply forming treatment to the obtained conductive thin film 4.
Description
Technical field [0001] The present invention relates to a surface conduction electron emitting element that can be used as an electron source for a display device such as a flat panel display or an image forming device such as an exposure device in a copier or a printer, and a method of manufacturing an image forming device using the same. Background technique [0002] As a surface conduction electron emission element, an element by Hartwell et al. has been reported (M. Hartwell and C, G, Fontad, "IEEE Trans. ED Conf." 519 (1975)). This surface conduction electron emitting element utilizes a phenomenon in which electrons are emitted by passing a current parallel to the film surface on a small-area conductive thin film formed on a substrate. [0003] It is known that the conductive thin film including the electron-emitting portion is composed of a conductive material deposited on an insulating substrate and is formed by a vacuum vapor deposition technique or a photolithography tec...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/00G03F7/16G03F7/36H01J9/02H01J1/30H01J31/15H01J31/12
CPCH01J9/027
Inventor 下田卓寺田匡宏森省诚
Owner CANON KK