Connection structure for display module and printed base plate and semiconductor device, display module and electronic member
A technology for connection structures and display modules, which is applied in the direction of support structure installation, printed circuit components, connections, etc., can solve the problems of unfavorable thin installation and achieve stable conduction and reliable contact
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Embodiment 1
[0056] Hereinafter, an embodiment of a connection structure between a display module and a printed circuit board, a semiconductor device, a display module, and electronic components of the present invention will be described.
[0057] FIG. 1 shows a liquid crystal module (display module) 1 in which a liquid crystal panel (display panel) 2 and a COF 3 serving as a liquid crystal driver (semiconductor device) are connected. A semiconductor element 4 constituting a liquid crystal driver IC and a plurality of mounting components 5 .
[0058] Furthermore, in this COF 3 , conventionally, planar electrodes are formed on the external connection terminals. In addition, the so-called external connection terminals are terminals for connecting the wiring formed on the flexible wiring board 3a and the electrodes of the printed board described later.
[0059] On the other hand, in this embodiment, pin-shaped pin electrodes (protrusion-shaped electrodes) 6 . . . formed of a conductive mater...
Embodiment 2
[0078]Hereinafter, another embodiment of the connection structure between the display module and the printed circuit board, the semiconductor device, the display module, and the electronic components of the present invention will be described using FIG. 6 and FIG. 7 . In addition, for the convenience of description, the components having the same functions as those shown in the drawings of the first embodiment are given the same reference numerals, and their descriptions are omitted.
[0079] A liquid crystal module (display module) 20 in this embodiment is shown in FIG. 6 . The liquid crystal module 20 has COF21 instead of COF3 in the structure of the liquid crystal module 1. In addition, COF21 has bump electrode 22... instead of pin electrode 6... in the structure of COF3.
[0080] That is, the semiconductor element 4 and the plurality of mounting parts 5 constituting the liquid crystal driver IC are mounted on the flexible wiring substrate 3a as the base of the COF 21. In ...
Embodiment 3
[0086] Hereinafter, another embodiment of the connection structure between the display module and the printed circuit board, the semiconductor device, the display module, and the electronic components of the present invention will be described using FIG. 8 . In addition, for the convenience of description, the components having the same functions as those shown in the drawings of the first embodiment are given the same reference numerals, and their descriptions are omitted.
[0087] A liquid crystal module (display module) 25 in this embodiment is shown in FIG. 8 . The liquid crystal module 25 has COF26 instead of COF3 in the structure of the liquid crystal module 1. Moreover, COF26 has the spring electrode 27 instead of the pin electrode 6... in the structure of COF3.
[0088] That is, a semiconductor element 4 and a plurality of mounting parts 5 constituting a liquid crystal driver IC are mounted on a flexible wiring substrate 3a serving as a base of the COF 26. In this reg...
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Abstract
Description
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Application Information
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