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Low temperature sinterable dielectric ceramic composition and multilayer ceramic chip capacitor using the same

A ceramic composition, low temperature sintering technology, applied in the direction of laminated capacitors, ceramic layered products, capacitors, etc., can solve the problem of difficult to prepare capacitors with large capacitance

Inactive Publication Date: 2007-07-18
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is difficult to prepare capacitors with large capacitance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0033] Weigh, mix and dissolve the sintering aid ZrO at a temperature of 1300-1400°C 2 -(K, Li) 2 O-SiO 2 Each component was quickly quenched in water and dry-milled, and then ground with ethanol to obtain a glass composition powder with a particle size of 0.5 μm or less.

[0034] Then, the BaTiO 3 The additive ingredients are mixed separately before mixing with the additive ingredients. Specifically, the above-mentioned glass composition powder mixture, and MgCO 3 , Y 2 o 3 、Cr 2 o 3 and V 2 o 5 The powders were weighed and wet mixed for 24 hours, then dried at 100°C for 3 hours or more. The average particle diameter of the mixed additive components is 0.3-0.4 μm. It is preferable that the maximum particle diameter of the additive components mixed is 3 μm.

[0035] Next, the BaTiO 3 Mix and disperse with previously mixed additive ingredients. Specifically, BaTiO with a particle size of 0.4 μm 3 Mix and disperse with previously mixed additive components in the p...

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PUM

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Abstract

A low temperature sinterable dielectric ceramic composition and a multilayer ceramic chip capacitor. The dielectric ceramic composition is expressed by the general formula: aBaTiO3-bMgCO3-cY2O3-dCr2O3-eV2O5-f(xZrO2-y(K,Li)2O-zSiO2) (x+y+z=1; 0.05<=x<=0.18, 0.01<=y<=0.08, and 0.7.4<=z<=0.93); in which a, b, c, d, e and f are molar ratios; a=100, 1.0<=b<=2.0, 0.2<=c<=2.0, 0.02<=d<=0.3, 0.02<=e<=0.3, and 0.5<=f<2. The multilayer ceramic chip capacitor is prepared using the dielectric ceramic composition. The dielectric composition according to the present invention can be sintered at a low temperature without decrease of a dielectric constant, making it possible to make ultra thin-layered dielectrics.

Description

technical field [0001] The present invention relates to a dielectric ceramic composition, more particularly, to a dielectric ceramic composition that can be sintered at a low temperature without a drop in dielectric constant, which makes it possible to manufacture ultra-thin layer dielectrics, and to multilayer ceramic sheets using the composition capacitor. Background technique [0002] With recent advances in the electronic equipment industry, there has been an increasing need to develop small electronic parts with large capacitance. Multilayer ceramic chip capacitors form a multilayer structure by alternating electrode layers and ceramic layers based on high dielectric constant. They are widely used as electronic parts featuring small size and large capacitance. [0003] Cheaper base metals such as Ni and Ni alloys are used as internal electrodes in multilayer ceramic chip capacitors instead of expensive noble metals such as Ag and Pd. During sintering in air, the inte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G4/30C04B35/468C04B35/46C04B35/00H01B3/12
CPCC04B2235/3418C04B2235/5445C04B2235/3239C04B2235/3206B32B2311/22C04B2235/3201C04B2235/36C04B2237/704H01G4/1227C04B2235/442C04B35/468C04B2237/405C04B2235/96C04B2237/346C04B2235/656C04B2235/3203C04B2235/3241C04B35/6303C04B2235/3225B32B18/00H01G4/1245C04B2235/3236C04B2235/3244H01G4/12
Inventor 金俊熙许康宪朴海成金钟翰金佑燮
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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