Assembling method for monolithic electronic member and monolithic electronic member

Abstract

The invention provides a method of assembling the same. An electronic component 103 is housed and held in a component housing unit 102 of a first substrate 101. A second substrate 105 is electrically connected to the electronic component, so that an integrated electronic component is formed by the first and second substrates. Accordingly, the arrangement precision is determined, based on the arrangement precision of the component housing unit, and the movement of the electronic components housed in the component housing unit is restricted. Furthermore, since the electronic components need only be housed in the component housing unit, work time is reduced. Thus, arrangement of the electronic components can be readily achieved with higher precision and at a lower cost as compared with a conventional method and an integrated electronic part is also provided.

Description

technical field [0001] The present invention relates to an integrated electronic component assembly method for assembling a plurality of electronic components into one body, and an integrated electronic component assembled by the assembly method. Background technique [0002] In recent years, with the progress of miniaturization and weight reduction of electronic components, various methods for further miniaturization of electronic components have been proposed. Among the electronic components formed by these methods, many are formed by assembling electronic components having two or more functions into one body rather than devices having one function. [0003] Conventionally, in order to arrange electronic components with high precision and high reliability, various assembly processes and equipment have been developed. Below, refer to Figure 8 ~ Figure 11 A conventional method for assembling electronic components will be described. [0004] First, if Figure 8 The conduc...

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Problems solved by technology

[0005] However, since the assembling method of the above-mentioned conventional structure is to assemble each component on the substrate 1 separately, it is not suitable for devices requiring assembling accuracy, such as optical component assembling that needs to combine optical paths, and the like. The electronic component 3 is placed on the conductive adhesive 2, so the height of the electronic component 3 on the substrate 1 is not uniform, so that when the substrate 5 is assembled in the following process, the electronic component 3 and the substrate 5 cannot form a good electrical connection. connection, that may form a so-called poor contact

In addition, in the case of assembling a large number of electronic components 3, it takes a long time to complete, and there will be a problem of component assembly quality on the conductive adhesive 2 and high cost due to this assembly rhythm.

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