Method for making casing of electronic device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
- Publication Date
- 2003-05-21
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
【Technical field】
[0001] The invention relates to a method for manufacturing an electronic device casing, in particular to a method for manufacturing an electronic device casing with better appearance and surface quality. 【Background technique】
[0002] At present, in order to obtain a metal texture for the plastic case of an electronic device, a metal layer is usually deposited on the surface of the plastic case through a plastic electroplating process. Related content can refer to US Patent No. 6,045,866. However, since plastic electroplating can only be plated on less active metals, such as copper and nickel, and more active metals, such as aluminum, are difficult to plate. In addition, due to the complex process of plastic electroplating itself, the production efficiency is low and the cost is high.
[0003] To solve the above problems, US Patent No. 5,660,934 discloses a method for obtaining a metal layer on a plastic workpiece through a thermal spraying (Thermal Spra...