High strain point glass

A technology of strain point and glass, applied in the field of -La2O3-Al2O3-SiO2 glass

Inactive Publication Date: 2003-06-04
CORNING INC
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  • Abstract
  • Description
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  • Application Information

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[0020] The present invention is based on our discovery of the titania-lanthanum oxide aluminosilicate glass series. These glasses have unique properties, especially suitable for the production of electronic devices with polysilicon thin films on the glass surface. More specifically, these glasses have strain points exceeding 780°C and 20-60×10 -7 / ℃, preferably 20~40×10 -7 / °C coefficient of thermal expansion. The glass also has a greater than 8.28 x 10 4 Young's modulus of MPa (12mpsi), and chemically, especially in buffered HF (BHF), the durability is very good. The titanium oxide therein can be partially or completely replaced by tantalum oxide without any detrimental effect on the CTE or strain point.

[0021] The buffered HF test measures the weight loss (mg / cm2) of a glass sample immersed in a buffered hydrofluoric acid solution for 5 minutes 2 ) and observe its appearance. The solution consists of 1 volume of 50 wt% HF and 10 volumes of 40 wt% ammonium fluoride (N...

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Abstract

A family of titania lanthana aluminosilicate glasses, and products such as an electronic device having a poly-silicon coating on such glass as a substrate, are disclosed. The glasses have a strain point in excess of 780 DEG C, a coefficient of thermal expansion of 20-60x10-7/ DEG C, a Young's modulus of greater than 12 Mpsi and are chemically durable.

Description

[0001] This application claims priority to US Patent Application No. 09 / 997,052, filed November 28, 2001, to Bruce G. Aitken et al., the contents of which are incorporated herein by reference. technical field [0002] The present invention relates to (TiO 2 , Ta 2 o 5 )-La 2 o 3 -Al 2 o 3 -SiO 2 Glass. Background technique [0003] Glass substrates for electronic devices should not be used and processed at temperatures exceeding about 600-650°C. For higher temperatures, the only transparent materials available are fused silica or glass-ceramic-like materials. These materials are difficult to manufacture and therefore expensive. [0004] Fused silica provides high strain points (typically >1000°C) and excellent thermal stability. However, it is difficult to produce and manufacture. At the same time, its low coefficient of expansion (CTE) (5×10-7 / °C) is incompatible with some electronic materials such as silicon. [0005] Transparent spinel glass-ceramics can al...

Claims

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Application Information

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IPC IPC(8): C03C17/22C03C3/083C03C3/095C03C3/097
CPCC03C3/083C03C3/095
Inventor B·G·艾特肯P·L·博克A·J·G·埃利森T·E·保尔森
Owner CORNING INC
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