High strain point glass

Abstract

A family of titania lanthana aluminosilicate glasses, and products such as an electronic device having a poly-silicon coating on such glass as a substrate, are disclosed. The glasses have a strain point in excess of 780 DEG C, a coefficient of thermal expansion of 20-60x10-7 / DEG C, a Young's modulus of greater than 12 Mpsi and are chemically durable.

Description

[0001] This application claims priority to US Patent Application No. 09 / 997,052, filed November 28, 2001, to Bruce G. Aitken et al., the contents of which are incorporated herein by reference. technical field [0002] The present invention relates to (TiO 2 , Ta 2 o 5 )-La 2 o 3 -Al 2 o 3 -SiO 2 Glass. Background technique [0003] Glass substrates for electronic devices should not be used and processed at temperatures exceeding about 600-650°C. For higher temperatures, the only transparent materials available are fused silica or glass-ceramic-like materials. These materials are difficult to manufacture and therefore expensive. [0004] Fused silica provides high strain points (typically >1000°C) and excellent thermal stability. However, it is difficult to produce and manufacture. At the same time, its low coefficient of expansion (CTE) (5×10-7 / °C) is incompatible with some electronic materials such as silicon. [0005] Transparent spinel glass-ceramics can al...

AI Technical Summary

Problems solved by technology

This is a serious challenge for forming precise flat glass