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Sonic surface wave filter modular

A surface acoustic wave and filter technology, applied in electrical components, impedance networks, etc., can solve the problems of narrowing pitch, difficulty in miniaturization, and difficulty in thinning

Inactive Publication Date: 2003-07-23
ALPS ALPINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a limit to the miniaturization of circuit components such as chip components and semiconductor components, and when mounting a large number of circuit components on a substrate, it is also necessary to consider that the soldered parts of each circuit component do not short-circuit, so that the gap between components is reduced. There is also a limit to narrowing the distance
Therefore, the surface acoustic wave filter module of the conventional structure has a problem that it is difficult to realize the miniaturization required recently.
And there is a problem that it is difficult to reduce the thickness due to the mounting of chip components

Method used

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  • Sonic surface wave filter modular
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  • Sonic surface wave filter modular

Examples

Experimental program
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Embodiment Construction

[0016] If the embodiment of the present invention is described with reference to the drawings, figure 1 It is a sectional view of the surface acoustic wave filter module related to the first embodiment, figure 2 is an explanatory diagram of the circuit of the module, with Figure 4 Corresponding parts use the same reference numerals.

[0017] figure 1 The surface acoustic wave filter module shown is a member used as a receiving unit of an antenna switch circuit, although the surface acoustic wave chip 2 having a filter function for reception is mounted in the concave portion 1a of the multilayer substrate 1. The embodiments are the same, but differ greatly from the previous embodiments in that the circuit elements are formed using thin film technology. That is, the surface acoustic wave filter module is generally composed of the following parts: a multilayer substrate 1 mounted on a mother board not shown in the figure; 2; the end surface electrode 4 extending from the s...

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Abstract

In a SAW filter module in which a SAW chip is mounted in a recess of a substrate, the recess is closed off by a sealing plate (5), and end-face electrodes (4) are provided on external surfaces including the side surfaces of the substrate. An insulation layer (8) having a smooth surface is provided on the side opposite to the sealing plate side of the substrate, and a thin film circuit (9), such as circuit elements, is formed on the insulation layer. A thin film circuit of high accuracy can be formed on the insulation layer, the number of chip components whose pitch between components is severely limited, and miniaturization of the entire module can be achieved.

Description

technical field [0001] The present invention relates to a surface mount type surface acoustic wave filter module using a surface acoustic wave chip of an electronic component utilizing surface acoustic wave (Surface Acoustic Wave: SAW) on a piezoelectric substrate as an antenna switch Filters such as circuits are combined. Background technique [0002] In antenna switching circuits for transmitting and receiving high-frequency signals, surface acoustic wave filters that select and pass signals of a specific frequency have been widely used in recent years as transmission filters or reception filters. Although such a surface acoustic wave filter is electrically connected to a surface acoustic wave chip formed by forming a predetermined electrode pattern on the surface of a piezoelectric substrate such as a crystal, since the surface acoustic wave chip is a relatively large chip component, it must be included in the arrangement of the surface acoustic wave filter. When manufac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/25H03H9/05H03H9/64
CPCH03H9/02574H03H9/0542H03H9/0552H03H9/25
Inventor 松田重俊
Owner ALPS ALPINE CO LTD