Preparation method of laminated slice type PTC heat sensitive resistor

A thermistor and lamination technology, applied in the direction of resistors with positive temperature coefficient, etc., can solve the problem that it is difficult to make good contact between the electrode and the ceramic sheet, the thickness of the chip PTC element should not be too thin, and the flatness of the ceramic sheet is difficult. Guarantee and other issues, to avoid the flatness of the tile, the uniformity of the BaTiO3 semiconducting ceramic water slurry, the uniformity of the PTC ceramic body and the sintered body

Inactive Publication Date: 2004-03-03
深圳市伟林高科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since the performance of the PTC element is directly related to the number of all grain boundaries between the two electrodes, this determines that the thickness of the chip PTC element should not be too thin, generally at the sub-micron level, and the chip green body is easy to warp and deform during firing. The flatness of the ceramic sheet is difficult to guarantee,

Method used

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  • Preparation method of laminated slice type PTC heat sensitive resistor
  • Preparation method of laminated slice type PTC heat sensitive resistor
  • Preparation method of laminated slice type PTC heat sensitive resistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1 (1) superfine BaTiO 3 Preparation of PTC-based powder

[0025] The composition of the PTC sample material is: (Ba 0.8 Sr 0.2 ) Ti 1.02 o 3 +0.6mol%Y 3+ +1mol%Al 3+ +1.5mol%Si 4+ +0.1mol%Mn 2+ . According to the ratio of metal ions in the formula, weigh BaCO 3 , SrCO 3 , Y 2 o 3 , Ti(C 4 h 9 O) 4 , and react with citric acid respectively to obtain the citrate aqueous solution of these four metal ions. The obtained solutions were mixed and ammonia water was added dropwise to adjust the pH value to 7. After uniform stirring by magnetic force, a transparent solution containing four components was obtained. According to the ratio of solution: organic monomer: cross-linking agent = 100ml: 20g: 8g, add acrylamide and N, N'-methylenebisacrylamide, in ammonium persulfate and N, N, N, 'N'- Under the initiation and catalysis of tetramethylethylenediamine, the monomers are cross-linked and polymerized to obtain a white translucent wet gel. After the w...

Embodiment 2

[0032] Use the same steps as in Example 1 to make a laminated chip PTC thermistor. The corresponding parameters are respectively as follows: get the BaTiO obtained in Example 1 3Base PTC powder 40g, add 6ml of water, 1.5ml of polymethacrylic acid solution with a concentration of 10wt%, and 1.5g of acrylamide and 0.04g of N,N'-methylenebisacrylamide, and ball mill for 6 hours to prepare The solid phase content is about 45vol% BaTiO 3 Water based semiconducting porcelain paste. Under the action of ammonium persulfate and N,N,N',N'-tetramethylethylenediamine, the slurry completes the polymerization reaction to form a gel. After 0.5h of solidification and molding, it is fired at 1330°C for 50min to obtain a rod-shaped PTC. For ceramics, the rod-shaped PTC ceramics are cut into chip components with a thickness of 0.4mm. After lamination and electrode firing, a laminated chip PTC thermistor is obtained.

[0033] The multilayer chip PTC thermistor has 5 layers, the size is 11mm×6...

Embodiment 3

[0035] Use the same steps as in Example 1 to make a laminated chip PTC thermistor. The corresponding parameters are respectively as follows: get the BaTiO obtained in Example 1 3 Base PTC powder 40g, add 5.5ml of water, 2ml of polymethacrylic acid solution with a concentration of 10wt%, and 1.5g of acrylamide and 0.01g of N,N'-methylenebisacrylamide, and mix by ball milling for 8 hours to prepare The solid phase content is about 45vol% BaTiO 3 Water based semiconducting porcelain paste. Under the action of hydrogen peroxide and N, N, N', N'-tetramethylethylenediamine, the slurry completes the polymerization reaction to form a gel, which is solidified and formed after 15 minutes, and fired at 1350 ° C for 20 minutes to obtain rod-shaped PTC ceramics , Cut the rod-shaped PTC ceramics into chip components with a thickness of 0.5mm. After lamination and electrode firing, a laminated chip PTC thermistor is obtained.

[0036] The multilayer chip PTC thermistor has 5 layers, the ...

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Abstract

The method includes following steps. Preparing superfine PTC powder of BaTiO3, preparing water slurry ceramics of BaTiO3, club-shaped PTC unburned base by using gel injection mold, sintering unburned base obtains club-shaped PTC porcelain, cutting porcelain to piece, laminating the pieces as well as burning and filtering of pole. Comparing with prior art, the invention using 'sintering-cutting-laminating' technique possesses advantages of good flatness, high reliability and high PTC effect.

Description

technical field [0001] The invention belongs to the technical field of ceramic materials, and in particular relates to a preparation method of a laminated chip PTC thermistor. Background technique [0002] Since the PTC thermistor is using BaTiO 3 The grain boundary characteristics of semiconducting ceramics, the PTC effect must be sintered in an oxidizing atmosphere, that is to say, the performance of the PTC thermistor depends on the electrical structure state formed by the oxidation of the grain boundary. Without sufficient oxidation, it is impossible to obtain high performance of PTC thermistor components. In order to prevent the oxidation of the metal electrodes when the laminated chip PTC thermistor is prepared by the traditional integral co-firing method of multilayer capacitors, a reducing atmosphere must be used for sintering, which is seriously contrary to the firing process of PTC materials. The internal electrode used in the chip-type laminated PTC thermistor p...

Claims

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Application Information

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IPC IPC(8): H01C7/02
Inventor 周东祥胡云香郑志平龚树萍
Owner 深圳市伟林高科技股份有限公司
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