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Light-emitting device

A light-emitting device and electroluminescent technology, applied in lighting devices, electroluminescent light sources, light sources, etc., can solve the problems of metal material corrosion, heat release, etc.

Inactive Publication Date: 2004-04-28
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Therefore, the purpose of the present invention is to solve the above-mentioned problem of heat release when using a film containing fluororesin (polytetrafluoroethylene (R)) as a protective film of an element, and to solve the problem of corrosion of metal materials caused by fluorine elements.

Method used

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Examples

Experimental program
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Embodiment Construction

[0043] Implementation Mode 1

[0044] In this Embodiment Mode 1, after the light-emitting element is formed, hereinafter, the figure 1 A detailed description will be given of the case where a lamination of an inorganic insulating film having heat dissipation and blocking effect on fluorine and a film containing a fluororesin having a function of preventing intrusion of moisture and oxygen is formed on the second electrode.

[0045] Note that in the present invention, the structure of the light-emitting device can adopt two structures, that is, a bottom-emitting type structure in which light generated by the light-emitting element is emitted from the side of the element substrate on which TFTs are formed, and a bottom-emitting type structure in which light generated by the light-emitting element is emitted from the side of the element substrate on which the TFT is formed. A top-emitting structure in which light is emitted from the opposite side of the element substrate. Embodi...

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Abstract

The present invention is to solve the problems of heat release and a metal material corrosion due to fluorine that are arisen in the case of using a film containing fluoroplastics (Teflon®) (113) as a protective film for a light-emitting device. In the present invention, an inorganic film (112) is formed after forming a light-emitting device, and a film containing fluoroplastics (113) is formed thereon for avoiding contact with a metal material for forming the light-emitting device, as a result, a metal material corrosion due to fluorine in the film containing fluoroplastics can be prevented. In addition, the inorganic insulating film has a function of preventing fluorine in the film containing fluoroplastics from reacting to the metal material (barrier property), in addition, the inorganic insulating film is formed of a material having high heat conductivity for releasing heat generated in a light-emitting device.

Description

technical field [0001] The present invention relates to a light-emitting device having a light-emitting element, wherein the light-emitting element is caused to emit light by applying an electric field to an element in which a film containing an organic compound (hereinafter referred to as an organic compound layer) is sandwiched between a pair of electrodes, and a method of manufacturing the light-emitting device. fluorescent or phosphorescent. Specifically, the present invention relates to a technique for achieving protection of the above-mentioned light-emitting element formed on an element substrate from moisture or oxygen by using a film made of a fluororesin. In this specification, the term light emitting device refers to an image display device, a light emitting device, or a light source (including a lighting device) using a light emitting element. And, the following module is included in the light emitting device: the light emitting element is loaded with a connector ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B33/04H01L27/32H01L51/50H01L51/52H05B33/10
CPCH01L27/3244H01L51/5237H01L51/529H10K59/12H10K59/8722H10K59/873H10K59/8794H10K50/87H10K50/844H10K50/8426
Inventor 山崎舜平高山彻鹤自卓也后藤裕吾
Owner SEMICON ENERGY LAB CO LTD