Thermal pressuring separating type sheets and its mfg. method

Abstract

There is a surface activation treated face 3 on at least one face of a glass fiber reinforced electrically conductive fluoro resin sheet 2. A dividing sheet 1 for hot press bonding is obtained by integrating the surface activation treated face 3 of the fluoro resin sheet and a vulcanized heat conductive electrically conductive silicone rubber laminate 4. The manufacturing method the dividing sheet comprises performing a surface activation treatment on at least one side of the glass fiber reinforced electrically conductive fluoro resin sheet 2, and integrating the surface activation treated face 3 of the fluoro resin sheet and the vulcanized silicone rubber laminate 4, in which the laminate was made by impregnating a glass cloth with electrically conductive fluoro resin mixture, sintering to form composite sheet, coating liquid heat conductive electrically conductive silicone rubber on at least one face of the sheet and thermally curing to form integrated laminate. Therefore, a dividing sheet for hot press bonding with high anti-electrostatic effect, excellent dividing capability and high durability can be provided.

Description

technical field [0001] The invention relates to a release sheet for thermocompression bonding. More specifically, it relates to a release sheet for thermocompression bonding that has thermal conductivity and can prevent electrostatic charging. Background technique [0002] When the external connection electrodes of the liquid crystal instrument panel and the external leads of the flexible circuit board (FPC) on which the driving semiconductor is bonded are thermally pressed together through an anisotropic conductive sheet-like adhesive, the heat-pressed separation The molded sheet is sandwiched between the thermocompression die and FPC of the thermocompression device, which can improve the parallelism of the thermocompression bonding surface, and prevent the FPC from adhering to the top of the thermocompression die of the thermocompression device during thermocompression. And be heat-compressed on. [0003] In recent years, as such release sheets for thermocompression bond...

AI Technical Summary

Problems solved by technology

[0005] (1) With the recent increase in the size of liquid crystal instrument panels, the thermal pressing time required to ensure the heat uniformity of the thermal pressing surface is prolonged, so the productivity decreases

[0006] (2) At the same time, since the heater temperature of the heating mold of the thermocompression device is set high, the durability of the thermocompression release sheet is reduced

[0007] (3) When thermocompression bonding is performed between the external connection electrodes of the LCD panel and the flexible circuit board (FPC) on which the driving semiconductor is overlapped, the static electricity generated will cause damage to the LCD panel, the driving semiconductor, etc.

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