Data erasing method for non volatile semiconductor storage

A non-volatile storage, data erasing technology, applied in static memory, read-only memory, information storage, etc., can solve the problem of difficult to achieve stable and high-speed erasing work

Inactive Publication Date: 2004-07-14
RENESAS ELECTRONICS CORP
View PDF1 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the second step to the fourth step of the above-mentioned well-known data erasing method, even when the pulse application operation is not required, the pulse

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Data erasing method for non volatile semiconductor storage
  • Data erasing method for non volatile semiconductor storage
  • Data erasing method for non volatile semiconductor storage

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] figure 1 It is a block diagram showing the schematic structure of the nonvolatile semiconductor memory 1 implementing the data erasing method of the present invention. This nonvolatile semiconductor memory 1 is formed of a flash memory using memory transistors as memory cells.

[0020] Like the conventional flash memory described above, this flash memory includes a plurality of nonvolatile memory transistors arranged in a matrix, a plurality of word lines for selecting rows of the memory transistors, and a plurality of word lines corresponding to the columns of the memory transistors respectively. A plurality of bit lines arranged in the ground are divided into a memory cell array of a plurality of memory blocks at the same time; a potential generating part that generates a potential applied to a word line, a bit line, a substrate part and a source of a memory transistor; and controlling the above-mentioned potential generating part , a write / erase control section that...

Embodiment 2

[0039] image 3 is a flowchart showing a data erasing method of the nonvolatile semiconductor memory 1 according to Embodiment 2 of the present invention. In contrast to Embodiment 1, in this embodiment, the erasure verification step S9 is performed only when the second erase pulse is applied, so that the erasing operation can be performed at a higher speed. For this purpose, in image 3 A step 17 of judging whether or not a second erase pulse is also applied to the memory transistor is added after the second erase verification step S8. When "No" in step S17, data erasing is ended in step S18. On the contrary, when step S17 is "Yes", the flow enters erasure verification step S9.

[0040] In this erasing work, by optimizing the conditions of step S14 of applying the first erasing pulse, step S15 of applying the programming pulse, step S16 of applying the second erasing pulse and recovery verification step S6, the The procedure of the over-erase verify operation and the over...

Embodiment 3

[0043] Figure 4 and Figure 5 is a flowchart showing a data erasing method of the nonvolatile semiconductor memory 1 according to Embodiment 3 of the present invention. In contrast to Embodiment 2, in this embodiment, in the second erasing verification step S8, a voltage of 0V is applied to the non-selected word lines, and at the same time, the over-erasing verification and over-erasing recovery steps S9-S12 are divided into the second There are two stages of steps S9 to S12 in the first stage and steps S19 to S22 in the second stage.

[0044] In this embodiment, since a voltage of 0V is applied to the non-selected word line in the second erasing verification step S8, the over-erasing verification and over-erasing recovery steps S9-S12 are also divided into the first stage steps S9-S12 and the second stage of steps S19 to S22, so it is possible to prevent the occurrence of read errors after the erasing is completed.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention is aimed to stabilize the erasing operation and to increase the erasing speed in a data erasing method of a nonvolatile semiconductor memory device. Unnecessary pulse applying operations are eliminated by performing verify-operation before pulse applying operations.

Description

technical field [0001] The present invention generally relates to an electrically writable and electrically erasable nonvolatile semiconductor memory, and more particularly to a nonvolatile semiconductor memory capable of erasing data for all storage transistors together or for each memory block when erasing (hereinafter known as "flash memory") data erasing method. Background technique [0002] A flash memory uses a transistor (hereinafter referred to as a "memory transistor") that may have a floating gate and that can change a threshold voltage as a memory cell. [0003] A conventional flash memory includes a plurality of nonvolatile storage transistors arranged in a matrix, a plurality of word lines for selecting rows of the storage transistors, and a plurality of bit lines provided corresponding to columns of the storage transistors, A memory cell array divided into a plurality of memory blocks at the same time; a potential generating unit generating a potential applied...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G11C16/02G11C16/16G11C16/34
CPCG11C16/3468G11C16/344G11C16/16
Inventor 沟口慎一二箇谷知士早坂隆
Owner RENESAS ELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products