Printing preparation of mini gap reversed-mounting welded convex templates with lead/tin or leadless solder

A template and technology technology, which is applied in the field of preparing flip-chip bump solder balls, can solve the problems of poor reliability, affecting the life of solder balls, process limitations, etc., and achieve the effect of reducing solder ball spacing and improving process controllability
CN1553480AInactive Publication Date: 2004-12-08THE HONG KONG UNIV OF SCI & TECH
0 Cites 4 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
THE HONG KONG UNIV OF SCI & TECH
Publication Date
2004-12-08
Estimated Expiration
Not applicable Β· inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invented technique of preparing solder ball for encapsulating semiconductor includes following steps: preparing metal level and back flow leading metal level under salient point by using technique of nickel-vanadium alloy and float pulling off technique; designing and preparing printing template based on size of solder ball and technological requirements; printing soldering paste on chip by using printing machine; based on requirement of soldering paste material, forming solder ball under certain temperature by back flow. The invention raises possibility of technical control for preparing solder ball through template printing technique, reduces space between solder balls and provides reliable solder ball for upside down mounting solder in different sizes and materials.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to electronic packaging, and is a technology for preparing flip-chip soldering bump solder balls on wafers or chips in the semiconductor process. Background technique

[0002] As the size of integrated circuit chips continues to shrink, electronic packaging technology is gradually developing in the direction of high performance, high density, high input / output ports, low cost, and miniaturization. New packaging technologies are becoming more and more widely used in the industry. Compared with packaging technologies such as surface mount (SMT), tape automatic bonding (TAB), quad flat package (QFP), pin grid array (PGA) and solder ball array (BGA), flip chip welding technology can meet the needs of electronic products. The high performance, small shape, high speed and high frequency requirements make the product have good electrical performance and heat transfer performance. In bump flip chip technology, bumps are metal solder ball...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More