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IC socket assembly

A technology of sockets and components, which is applied in the field of IC socket components, can solve problems such as discrepancies in flatness of circuit boards, deterioration of electrical connection reliability, and inability to ensure coplanarity, so as to ensure reliability, ensure coplanarity, and reduce warping and deformation effects

Inactive Publication Date: 2005-01-26
TYCO ELECTRONICS JAPAN GK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These loads may deform the case, thereby making the board mounting surface of the bottom of the case less flat than the printed circuit board.
That is, coplanarity between the bottom surface of the housing and the printed circuit board cannot be ensured
Therefore, the electrical connection reliability between the bottom surface (circuit board mounting surface) of the case and the printed circuit board is deteriorated

Method used

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  • IC socket assembly
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Examples

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Embodiment Construction

[0042] Hereinafter, preferred embodiments of the IC socket assembly (hereinafter simply referred to as "assembly") according to the present invention will be described with reference to the accompanying drawings. figure 1 is a plan view of an assembly 1 according to the first embodiment, wherein the assembly 1 is mounted on a printed circuit board 2 (hereinafter simply referred to as "circuit board"). figure 2 yes figure 1 A front view of the state of assembly 1 is shown. refer to figure 1 and figure 2 Describe component 1. The assembly 1 includes: a frame 6, which is located on the first surface 2a of the circuit board 2; a rear plate 8, which is mounted on the second surface 2b of the circuit board 2 opposite to the first surface 2a, corresponding to the position of the frame 6; A socket housing 4 (hereinafter simply referred to as "housing") for accommodating the IC socket 5 is provided in the frame 6; a heat sink 10 is mounted to the top of the housing 4; and a load ...

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Abstract

The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.

Description

technical field [0001] The present invention relates to an IC socket of the type that dissipates heat generated by an integrated circuit package with a heat sink. More particularly, the present invention relates to IC socket assemblies in which the heat sink is mounted by pressing onto the IC assembly in the IC socket. Background technique [0002] Known conventional IC socket assembly such as in Japanese unexamined patent application No.2001-24370 ( figure 1 and 2 ) published in . Such an IC socket assembly includes a heat sink mounted on top of an IC assembly mounted on a socket housing. The linear mounting / moving / pressing element is rotatably connected to the IC socket. The heat sink is pressed against and mounted to the IC package by the linear element. [0003] Another conventional IC socket assembly is known as disclosed in Japanese Unexamined Patent Application No. 2003-7942 (FIG. 3). The IC socket assembly includes a socket housing housing a plurality of electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R33/76H01L23/36H01L23/40H05K7/20
CPCH01L2924/0002H01L23/4093H01L2924/00
Inventor 桥本信一
Owner TYCO ELECTRONICS JAPAN GK
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