47results about How to "Ensure coplanarity" patented technology

The invention discloses a preparing method for a corrosion-resistant liquid cooling heat dissipation cold plate and aims at providing a cold plate preparing method which is free of tedious treatment before welding and has prominent corrosion-resistant capability and long-term work reliability. According to the technical scheme, the two sides of a bottom transverse pipe commonly communicated serve as the starting points respectively, two sets of parallel pipes are longitudinally arranged continuously in a bent manner, and the bending radius of bent circular arc rings on the two longitudinal sides is larger than the distance between every two parallel pipelines; the free ends of each set of parallel pipes are fixedly connected through respective connector flanges; and the two sets of parallel pipes are fixed, clamped and positioned through pipeline clamping tools which are longitudinally arranged at intervals, die positioning plates with screw holes are adopted, wax patterns wrapping runner titanium pipes and connector flange assemblies are clamped between the two die positioning plates, and the runner titanium pipes and the connector flange assemblies are put into a smelting furnace, and a rectangular flat plate is formed through lost foam casting. The preparing method solves the problem that during traditional cold plate welding, a welding seam is prone to cracking, and consequently a cooling agent leaks.

The invention relates to a multi-parameter adjustable clamp device for an ECT sensor and belongs to the field of auxiliary detection. The clamp mainly comprises a rotating joint, a rod piece, a clamping sliding block, a flat-end screw, a locating clamping part, a bolt, a T-shaped turning piece, a hexagon nut, a pole plate pressing block, an angle locating buckle, an L-shaped supporting rod and a supporting sliding block. The multi-parameter adjustable clamp device enables each pole plate of the sensor to be in tight contact with a pipeline and be firmly fixed and be easy to assemble and disassemble; the coplanarity of each pole plate of the sensor on the circumferential plane and distribution uniformity of a pole plate array (the central angle between adjacent probes is the same) can be guaranteed; and the multi-parameter adjustable clamp device can be suitable for installing cylindrical pipelines of different diameters. The designed clamp can be used for auxiliary measurement of the capacitance of the specific ECT sensor; and the clamp has a certain universality and is flexible and convenient.

The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.

An electrical connector (1) includes an insulative housing (10) and a plurality of stamped contacts (12) resided therewithin. The conductive contact includes a central spring beam (122), a side spring beam (124) located at one side of the central spring beam, and a contact portion (121) formed between the central spring beam and the side spring beam for electrically mating with a mating component. The central spring beam extends inwardly of the contact portion and towards an end portion of the side spring beam. Such a configuration of the central spring beam will ensure that the conductive contact has a predetermined robustness thereof while possessing the required spring properties for the stamped contact.

A shield terminal (20) includes an inner conductor terminal (21) and an outer conductor terminal (22) surrounding the inner conductor terminal (21). The outer conductor terminal (21) has a pull-out opening (46) through which an inner conductor connecting piece (26) of the inner conductor terminal (21) is pulled toward a circuit board (90). The outer conductor terminal (22) includes outer conductor connecting pieces that face the pull-out opening (46) and that include first and second outer conductor connecting pieces (53, 54) located on both sides across the inner conductor connecting piece (26) in a plan view and a third outer conductor connecting piece (42) that faces the inner conductor connecting piece (26) in a direction orthogonal to an arrangement direction of the first and second outer conductor connecting pieces (53, 54) at a position between the first and second outer conductor connecting pieces (53, 54) in the arrangement direction.

The invention discloses a method for preparing wafers having bumps with different diameters. The method includes the following steps: for wafers having the bumps with the same composition and different diameters, adopting a small-opening ball placing net plate to complete the placing of a small-sized solder ball first, and then switching to a large-opening ball placing net plate to complete the placing of a large-sized solder ball, and performing uniform refluxing on the whole wafers; and for the wafers having the bumps with different compositions and different diameters, adopting a small-opening ball placing net plate to complete the placing and refluxing of a small-sized solder ball first, and then switching to a large-opening ball placing net plate to complete the placing and refluxingof a large-sized solder ball. According to the scheme of the invention, the bumps with various diameters and different compositions can be prepared on the same wafer by switching the ball placing netplates, and thus the advantages of simple process, high yield and high reliability can be achieved.

A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.

An insertion method for manufacturing the electric connector containing multiple electric conducting terminals and a metallic framke includes assembling said terminals and metallic frame together, putting it in mould cavity, inserting the detachable first and second fixers between adjacent terminals from their free ends and tail ends, espectively, and filling the fused resin in the mould cavity to form an insulating casing.

The invention relates to a multi-chip upright tile sandwich package structure and a technique therefor. The technique comprises the following steps: (1) providing a first lead frame; (2) coating the first lead frame with a solder paste; (3) implanting a first chip into the solder paste of the first lead frame; (4) providing a second lead frame; (5) coating the second lead frame with the solder paste; (6) laminating the second lead frame on the first chip; (7) carrying out reflow soldering; (8) coating the second lead frame with the solder paste; (9) implanting a second chip into the second lead frame; (10) providing a third lead frame; (11) coating the third lead frame with the solder paste; (12) laminating the third lead frame on the second chip; (13) carrying out reflux soldering; (14) carrying out plastic package by a molding compound; and (15) carrying out cutting or punching operation. The technique has the beneficial effects that the heat dissipation capacity of a product is improved and the package resistance of the product is reduced.

The invention provides a weld leg component, an arrayed weld leg module and a key component. The key component includes a base. The weld leg component includes a support and weld leg, wherein the support is connected with the base; one end of the weld leg is connected with the support, and the other end of the weld leg is bent away from the base and extended below the support; the weld leg and thesupport are at least partially overlapped relative to the projection of the base; the support can support the weld leg; chances for the weld leg to deform are slimmed; weld leg coplanarity is effectively ensured at the premise of not greatly increasing the manufacture difficulty; key component fitting effect is improved.

The invention relates to a multi-chip integrated stacked sandwiched packaging structure and a technological method therefor. The technological method comprises the following steps of step 1, providing a first lead frame; step 2, coating the first lead frame with solder paste; step 3, implanting a first chip into the first lead frame solder paste; step 4, providing a second lead frame; step 5, coating the second lead frame with the solder paste; step 6, enabling the first chip to be laminated by the second lead frame; step 7, performing reflow soldering; step 8, coating the second lead frame with the solder paste; step 9, implanting a second chip into the second lead frame solder paste; step 10, providing a third lead frame; step 11, coating the third lead frame with the solder paste; step 12, enabling the second chip to be laminated by the third lead frame; step 13, performing reflow soldering; step 14, performing plastic package by a plastic package material; and step 15, performing a cutting or punching operation. The technological method has the beneficial effects that the thermal dissipation capability of products is improved, and the packaging resistance of the products is lowered.

A fixing device for fixing of two bodies to each other, for example a panel to a wall or two panels to each other, includes a male element having a support base and an engaging element, the support base having a rear surface for leaning onto one of the two bodies to be connected and a front surface from which the engaging element protrudes; and a female element having a support base with a rear surface for leaning and fixing onto the other body and a receiving channel for receiving the engaging element of the male element so that the engaging element, when inserted into the receiving channel, snaps inside it detachably, thus enabling the releasable coupling of the two bodies. The fixing device is configured for selecting two or more different distances along the axis defined by the rear surfaces of the male and female elements when coupled.