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47results about How to "Ensure coplanarity" patented technology

Preparing method for corrosion-resistant liquid cooling heat dissipation cold plate

ActiveCN105268918AEnsure coplanarityLittle structural requirementsFoundry mouldsFoundry coresWeld seamEngineering
The invention discloses a preparing method for a corrosion-resistant liquid cooling heat dissipation cold plate and aims at providing a cold plate preparing method which is free of tedious treatment before welding and has prominent corrosion-resistant capability and long-term work reliability. According to the technical scheme, the two sides of a bottom transverse pipe commonly communicated serve as the starting points respectively, two sets of parallel pipes are longitudinally arranged continuously in a bent manner, and the bending radius of bent circular arc rings on the two longitudinal sides is larger than the distance between every two parallel pipelines; the free ends of each set of parallel pipes are fixedly connected through respective connector flanges; and the two sets of parallel pipes are fixed, clamped and positioned through pipeline clamping tools which are longitudinally arranged at intervals, die positioning plates with screw holes are adopted, wax patterns wrapping runner titanium pipes and connector flange assemblies are clamped between the two die positioning plates, and the runner titanium pipes and the connector flange assemblies are put into a smelting furnace, and a rectangular flat plate is formed through lost foam casting. The preparing method solves the problem that during traditional cold plate welding, a welding seam is prone to cracking, and consequently a cooling agent leaks.
Owner:10TH RES INST OF CETC

IC socket assembly

The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.
Owner:TYCO ELECTRONICS JAPAN GK

Contact for an electrical connector

An electrical connector (1) includes an insulative housing (10) and a plurality of stamped contacts (12) resided therewithin. The conductive contact includes a central spring beam (122), a side spring beam (124) located at one side of the central spring beam, and a contact portion (121) formed between the central spring beam and the side spring beam for electrically mating with a mating component. The central spring beam extends inwardly of the contact portion and towards an end portion of the side spring beam. Such a configuration of the central spring beam will ensure that the conductive contact has a predetermined robustness thereof while possessing the required spring properties for the stamped contact.
Owner:HON HAI PRECISION IND CO LTD

Sandwich packaging technique for preventing chip from deviating

The invention relates to a sandwich packaging technique for preventing a chip from deviating. The sandwich packaging technique comprises the following steps: (1) providing a first lead frame; (2) coating an island region of the first lead frame with a solder paste; (3) implanting the chip into the first lead frame; (4) providing a second lead frame; (5) coating the second lead frame with the solder paste; (6) laminating the second lead frame on the chip on the upper surface of the first lead frame to form an overall frame; (7) pressing the upper surface and the lower surface of the overall frame formed in the step (6) with pressure plates and carrying out reflow soldering; (8) carrying out plastic packaging on the overall frame which is subjected to reflow soldering in the step (7); and (9) carrying out cutting or punching operation on a semi-finished product which is subjected to plastic packaging in the step (8), cutting or punching an original array-type plastic package body for separation, so as to prepare a sandwich package structure for preventing the chip from deviating. The sandwich packaging technique has the beneficial effect that the thickness, the area and the position of the solder paste can be easily controlled.
Owner:JCET GROUP CO LTD

Multi-chip and multi-shingle stacked sandwich package structure with exposed frames and technique of multi-chip and multi-shingle stacked sandwich package structure

InactiveCN105405834AReduce package resistanceReduction of interconnection processSemiconductor/solid-state device detailsSolid-state devicesPunchingPlastic packaging
The invention relates to a multi-chip and multi-shingle stacked sandwich package structure with exposed frames and a technique of the multi-chip and multi-shingle stacked sandwich package structure. The method comprises the following steps: (1) providing a first lead frame; (2) coating the first lead frame with a tin paste; (3) implanting a first chip into the tin paste of the first lead frame; (4) providing a second lead frame, coating the second lead frame with the tin paste; (5) laminating the second lead frame on the first chip; (6) carrying out reflow soldering; (7) coating the second lead frame with the tin paste; (8) implanting a second chip into the second lead frame; (9) providing a third lead frame, coating the third lead frame with the tin paste; (10) laminating the third lead frame on the second chip; (11) carrying out reflow soldering; (12) carrying out plastic packaging with a molding compound; and (13) carrying out a cutting or punching operation. The multi-chip and multi-shingle stacked sandwich package structure with the exposed frames have the beneficial effects that the heat dissipating ability of a product is increased; and the package resistance of the product is reduced.
Owner:JCET GROUP CO LTD

Method for preparing wafers having bumps with different diameters

The invention discloses a method for preparing wafers having bumps with different diameters. The method includes the following steps: for wafers having the bumps with the same composition and different diameters, adopting a small-opening ball placing net plate to complete the placing of a small-sized solder ball first, and then switching to a large-opening ball placing net plate to complete the placing of a large-sized solder ball, and performing uniform refluxing on the whole wafers; and for the wafers having the bumps with different compositions and different diameters, adopting a small-opening ball placing net plate to complete the placing and refluxing of a small-sized solder ball first, and then switching to a large-opening ball placing net plate to complete the placing and refluxingof a large-sized solder ball. According to the scheme of the invention, the bumps with various diameters and different compositions can be prepared on the same wafer by switching the ball placing netplates, and thus the advantages of simple process, high yield and high reliability can be achieved.
Owner:BEIJING MXTRONICS CORP +1

Differential screw height-adjustable LED (light emitting diode) lamp base and T-shaped calibrating form board using same

The invention provides a differential screw height-adjustable LED (light emitting diode) lamp base and a T-shaped calibrating form board using the same, relates to a vision calibrating form board, and belongs to the technical field of vision measurement. The differential screw height-adjustable LED lamp base consists of a height-adjustable lamp base body, a fixed seat, an adjusting sleeve, a shell and an anti-rotating spring. On the premise that LED spots do not rotate, the LED spots are only adjusted along a vertical direction of a coplane by 0.5mm when the adjusting sleeve rotates at an angle of 360 degrees, and if instruments such as a high-precision coordinate measuring machine and the like are adopted, 5-micrometer coplane adjusting precision of the LED spots can be achieved by manually adjusting the adjusting sleeve. The calibrating form board comprises a planar T-shaped calibrating form board structure consisting of five coplanar infrared LED spots. The differential screw height-adjustable LED lamp base and the T-shaped calibrating form board using the same are suitable for the field of vision measurement on camera parameter calibration by using the form board.
Owner:HARBIN INST OF TECH

Method for mfg. electric connector containing multi-conducting terminals and metal frame by plugging shaping method

An insertion method for manufacturing the electric connector containing multiple electric conducting terminals and a metallic framke includes assembling said terminals and metallic frame together, putting it in mould cavity, inserting the detachable first and second fixers between adjacent terminals from their free ends and tail ends, espectively, and filling the fused resin in the mould cavity to form an insulating casing.
Owner:MOLEX INC

Multi-chip upright tile sandwich package structure and technique therefor

InactiveCN105551982AReduce package resistanceReduction of interconnection processSemiconductor/solid-state device detailsSolid-state devicesReflow solderingSolder paste
The invention relates to a multi-chip upright tile sandwich package structure and a technique therefor. The technique comprises the following steps: (1) providing a first lead frame; (2) coating the first lead frame with a solder paste; (3) implanting a first chip into the solder paste of the first lead frame; (4) providing a second lead frame; (5) coating the second lead frame with the solder paste; (6) laminating the second lead frame on the first chip; (7) carrying out reflow soldering; (8) coating the second lead frame with the solder paste; (9) implanting a second chip into the second lead frame; (10) providing a third lead frame; (11) coating the third lead frame with the solder paste; (12) laminating the third lead frame on the second chip; (13) carrying out reflux soldering; (14) carrying out plastic package by a molding compound; and (15) carrying out cutting or punching operation. The technique has the beneficial effects that the heat dissipation capacity of a product is improved and the package resistance of the product is reduced.
Owner:JCET GROUP CO LTD

IC socket assembly

The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.
Owner:TYCO ELECTRONICS JAPAN GK

Method for mfg. electric connector containing multi-conducting terminals and metal frame by plugging shaping method

A method for manufacturing an electrical connector comprising a plurality of conductive terminals and a metal frame by insert molding, comprising presetting a core composed of conductive terminals and a metal frame into a mold cavity, wherein the metal frame includes a mounting surface and a plugging surface perpendicular to the mounting surface, and the conductive terminal includes a contact portion and a solder tail that are parallel to the mounting surface and the plugging surface of the metal frame respectively; The direction of the installation surface is inserted into the gap between two adjacent contact parts from the free end of the contact part of the conductive terminal to maintain a certain distance between the contact parts of each conductive terminal, and to move the removable second fixer along the direction of the metal The direction of the frame insertion surface is inserted from the free end of the welding tail of the conductive terminal into the gap between two adjacent welding tails, so as to keep the tails of each conductive terminal on the same plane; then inject a molten resin into the mold cavity, The molten resin forms an insulating shell on the peripheral surface of the core, which can combine the conductive terminal group and the metal frame and cover part of its area.
Owner:MOLEX INC

Reading microscope calibrating device

The invention relates to a reading microscope calibrating device, and belongs to the technical field of precise calendar design and measuring instrument detection. Aiming at the nonexistence of an integral special calibrating device, the invention deliberately provides a special calibrating device of an autonomic system for calibration of a reading microscope. The reading microscope calibrating device consists of five parts comprising a body part, a clamping mechanism, a longitudinal and transverse motion mechanism, an illumination system and a light source part. The body part forms a main body of the device and is provided with an 'interface' for integrating other parts; and the clamping mechanism arranged above the device is used for firmly clamping the reading microscope on the device.The longitudinal and transverse motion mechanism arranged in the abdomen of the device is used for adjusting the relative positions of a scale and the reading microscope; and the illumination system and the light source part which are arranged at the lower rear part inside the device are used for illuminating the scale which cannot be illuminated by use of natural light and external light. The device ensures that the axis of the clamped reading microscope is inclined forwards at 15 degrees by virtue of the structural design so as to facilitate human eye observation and measurement.
Owner:GUANGDONG INST OF METROLOGY

FP type chip pin forming device and forming method

PendingCN112845957AGuaranteed no lateral displacementEnsure coplanarityEngineeringStructural engineering
The invention relates to an FP type chip pin forming device and a forming method. The device comprises a clamping device, an upper die and a lower die; the lower die comprises a bottom plate, two first convex ribs and a convex strip, the convex strip is located in the center of the bottom plate, and the two first convex ribs are symmetrically distributed on the two sides of the convex strip; the upper die comprises a top plate, two first flanges and two second flanges, and the two first flanges and the two second flanges are symmetrically distributed with respect to the central axis of the top plate; the heights of the first convex ribs, the convex strip and the bottom plate of the lower die are sequentially decreased; and the heights of the top plate, the two first flanges and the two second flanges of the upper die are sequentially increased. According to the FP type chip pin forming device and the forming method, the forming mode is one-time forming, so that the lateral displacement of a chip pin caused by repeated bending when the chip pin is bent by tweezers is avoided.
Owner:大连长丰实业总公司

Multi-chip upright stack sandwich package structure with exposed frame and technique for multi-chip upright stack sandwich package structure

InactiveCN105551983AReduce package resistanceReduction of interconnection processSemiconductor/solid-state device detailsSolid-state devicesPunchingEngineering
The invention relates to a multi-chip upright stack sandwich package structure with an exposed frame and a technique for the multi-chip upright stack sandwich package structure. The technique comprises the following steps: (1) providing a first lead frame; (2) coating the first lead frame with a solder paste; (3) implanting a first chip into the solder paste of the first lead frame; (4) providing a second lead frame; (5) coating the second lead frame with the solder paste; (6) laminating the second lead frame on the first chip; (7) carrying out reflow soldering; (8) coating the second lead frame with the solder paste; (9) implanting a second chip into the second lead frame; (10) providing a third lead frame; (11) coating the third lead frame with the solder paste; (12) laminating the third lead frame on the second chip; (13) carrying out reflux soldering; (14) carrying out plastic package by a molding compound; and (15) carrying out cutting or punching operation. The technique has the beneficial effects that the heat dissipation capacity of a product is improved and the package resistance of the product is reduced.
Owner:JCET GROUP CO LTD

Multi-chip integrated stacked sandwiched packaging structure and technological method therefor

InactiveCN105552042AReduce package resistanceReduction of interconnection processSemiconductor/solid-state device detailsSolid-state devicesElectrical resistance and conductancePunching
The invention relates to a multi-chip integrated stacked sandwiched packaging structure and a technological method therefor. The technological method comprises the following steps of step 1, providing a first lead frame; step 2, coating the first lead frame with solder paste; step 3, implanting a first chip into the first lead frame solder paste; step 4, providing a second lead frame; step 5, coating the second lead frame with the solder paste; step 6, enabling the first chip to be laminated by the second lead frame; step 7, performing reflow soldering; step 8, coating the second lead frame with the solder paste; step 9, implanting a second chip into the second lead frame solder paste; step 10, providing a third lead frame; step 11, coating the third lead frame with the solder paste; step 12, enabling the second chip to be laminated by the third lead frame; step 13, performing reflow soldering; step 14, performing plastic package by a plastic package material; and step 15, performing a cutting or punching operation. The technological method has the beneficial effects that the thermal dissipation capability of products is improved, and the packaging resistance of the products is lowered.
Owner:JCET GROUP CO LTD

Preparation method of anti-corrosion liquid-cooled heat dissipation cold plate

ActiveCN105268918BEnsure coplanarityLittle structural requirementsFoundry mouldsFoundry coresWaxWeld seam
The invention discloses a preparing method for a corrosion-resistant liquid cooling heat dissipation cold plate and aims at providing a cold plate preparing method which is free of tedious treatment before welding and has prominent corrosion-resistant capability and long-term work reliability. According to the technical scheme, the two sides of a bottom transverse pipe commonly communicated serve as the starting points respectively, two sets of parallel pipes are longitudinally arranged continuously in a bent manner, and the bending radius of bent circular arc rings on the two longitudinal sides is larger than the distance between every two parallel pipelines; the free ends of each set of parallel pipes are fixedly connected through respective connector flanges; and the two sets of parallel pipes are fixed, clamped and positioned through pipeline clamping tools which are longitudinally arranged at intervals, die positioning plates with screw holes are adopted, wax patterns wrapping runner titanium pipes and connector flange assemblies are clamped between the two die positioning plates, and the runner titanium pipes and the connector flange assemblies are put into a smelting furnace, and a rectangular flat plate is formed through lost foam casting. The preparing method solves the problem that during traditional cold plate welding, a welding seam is prone to cracking, and consequently a cooling agent leaks.
Owner:10TH RES INST OF CETC

Method for manufacturing large-scale integrated circuit lead frame

ActiveCN101630644BAlleviate and reduce warpageAvoid hook misalignment and deformationSemiconductor/solid-state device detailsSolid-state devicesState of artSingle plate
The invention discloses a method for manufacturing a large-scale integrated circuit lead frame, which overcomes the defect of lower index qualification rate of the coplanarity and the displacement of pins of a lead frame manufactured in the prior art. The method comprises the following steps: (1) continuously stamping: continuously stamping a zone ring with a lead frame original blank on a die; (2) continuously electroplating: electroplating the zone ring with the lead frame original blank, wherein the electroplating area comprises the root welding area of the pins and the front surface of the chip island; and (3) slicing and confirming the size: cutting and flaking the electroplated zone ring to obtain a single plate lead frame piece, wherein in the step of continuous stamping, a connecting rib for connecting the end parts of a plurality of pins at each side into a whole is retained at one end of the pins in the lead frame original blank approaching to the four sides of the chip island, and in the step of slicing and confirming the size, when the zone ring is cut and the size is confirmed, the connecting rib of the end parts of the pins approaching to the four sides of the chip island is also cut off to obtain a finished lead frame. The invention can greatly improve the qualification rate of the coplanarity and the displacement of the pins of the finished lead frame.
Owner:NINGBO HUALONG ELECTRONICS

Differential spiral height adjustment LED lamp holder and T-shaped calibration template using the differential spiral lamp holder structure

A T -type calibration template that uses the differential spiral lamp structure with the differential spiral lamp structure, which involves a visual calibration template, which belongs to the field of visual measurement technology.The invention provides a highly adjustable spiral spiral high LED lamp holder, and a T -shaped calibration template with the differential spiral lamp structure.The differential spiral lamp holders are composed of raising lamp holders, fixed seats, adjustments, shells, and anti -rotating spring. Under the premise of ensuring that the LED light spot does not rotate, the LED is achieved when the adjustment sleeve rotates 360 degrees 360 degrees.The light spots are adjusted by 0.5mm per vertical direction in the common surface. If the instrument and other instruments such as high -precision coordinate measuring machines are used, the co -adjustment accuracy of the LED light spot 5 microns can be achieved by manual adjustment and adjustment.The calibration template includes a plane T -type calibration template structure composed of 5 co -infrared LED light points.The present invention is suitable for the field of visual measurement in the use of the template for camera parameter calibration.
Owner:HARBIN INST OF TECH
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