Preparing method for corrosion-resistant liquid cooling heat dissipation cold plate

Abstract

The invention discloses a preparing method for a corrosion-resistant liquid cooling heat dissipation cold plate and aims at providing a cold plate preparing method which is free of tedious treatment before welding and has prominent corrosion-resistant capability and long-term work reliability. According to the technical scheme, the two sides of a bottom transverse pipe commonly communicated serve as the starting points respectively, two sets of parallel pipes are longitudinally arranged continuously in a bent manner, and the bending radius of bent circular arc rings on the two longitudinal sides is larger than the distance between every two parallel pipelines; the free ends of each set of parallel pipes are fixedly connected through respective connector flanges; and the two sets of parallel pipes are fixed, clamped and positioned through pipeline clamping tools which are longitudinally arranged at intervals, die positioning plates with screw holes are adopted, wax patterns wrapping runner titanium pipes and connector flange assemblies are clamped between the two die positioning plates, and the runner titanium pipes and the connector flange assemblies are put into a smelting furnace, and a rectangular flat plate is formed through lost foam casting. The preparing method solves the problem that during traditional cold plate welding, a welding seam is prone to cracking, and consequently a cooling agent leaks.

Description

technical field

[0001] The invention relates to a heat transfer structural part, and relates to a casting process method of a buried tube type dissimilar material for a heat dissipation cold plate that takes away heat through a cooling liquid. Background technique

[0002] In recent years, with the improvement of electronic equipment miniaturization, modularization, and high integration design requirements, the heat flux density often reaches 7 to 10 times that of traditional air-cooled equipment. Due to the centralized installation of modules, there are a large number of heat-generating module, so the problem of heat dissipation is very prominent. At present, most electronic equipment at home and abroad use cold plate liquid indirect cooling technology with high cooling efficiency to solve the heat dissipation problem. The salient feature of common liquid-cooled cold plates is that the flow channel is integrated with the metal substrate, and the coolant runs in the flow ch...

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