Wafer preparation method with bumps of different diameters
A technology of bumps and wafers, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as high cost, difficult preparation process, and inability to prepare bumps with different components. High yield and reliability, improved ball drop accuracy, and simple method
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Embodiment 1
[0045] Such as Figure 2(a) ~ Figure 2(c) As shown, for the case where the bump components are the same, in this embodiment, the under-bump metallization layer is prepared according to the difference in the size of the bumps with different diameters, and then the ball screen with a smaller opening is used to place small-sized solder joints at the required positions. Balls, and then use a large-opening ball-setting screen to place large-size solder balls at the required positions, reflow the wafers with solder balls of different diameters, and complete the bump preparation. Finally, the bumps on the wafer surface are co-processed Face detection. This "drop-drop-back" technological process has a simple implementation method and high work efficiency, yield and reliability. The method specifically includes the following steps:
[0046] (1), preparing the UBM layer 5 at the corresponding position on the insulating layer 6 on the surface of the wafer 7;
[0047] The UBM layer is ...
Embodiment 2
[0059] For the case where the components of the bumps are different, in this embodiment, the solder flux is first printed on the surface of the wafer with the UBM layer prepared, and a small-sized solder ball is placed on the desired position using a ball placement screen with a smaller opening. Wafer reflow is carried out first to complete the preparation of small-size bumps, then flux spraying is performed on the positions of large-size bumps, and then large-size solder balls are missed by using a ball-setting screen with a larger opening, and finally the wafer is reflowed to complete large-size bumps. Bump preparation, this "drop-back-drop-back" process can effectively avoid the impact of the second ball placement on the first placement of the solder balls, and at the same time can realize the preparation of bumps with different components, and can prepare melting point Taller small size bumps, followed by larger size bumps with lower melting points. Specifically include th...
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