Pixel position specifying method, method of correcting image offset, and image forming device

Abstract

The invention provides a pixel positioning method, an image shift correction method and an imaging device, which comprises following steps: opening a first connecting pixel near a connecting joint of a first exposure head; moving a beam position detector along a Y axis; detecting a first exposure beam position in XY coordinate on the light receiving side; opening a second connecting pixel near a connecting joint of a second exposure head; moving the beam position detector along the Y axis; detecting the exposure beam position in XY coordinate on the light receiving side; positioning the first pixel and second pixel according to the motion quantity of the beam position detector along the Y axis and the exposure beam positions of the first exposure head and the second exposure head on the light receiving side. The pixel positioning method and image shift correction method as well as the imaging device has the advantages of reducing shift among the images formed by the exposure heads in the multi-head exposure devices.

Description

technical field [0001] The present invention relates to a pixel position specifying method, an image offset correction method, and an image forming apparatus. In particular, in an image forming apparatus equipped with a plurality of exposure heads, even if the relative position between the exposure heads changes, the pixel position identification method can identify the positions of connected pixels in the exposure heads with high precision, and can form a connection point that is not conspicuous. An image shift correction method for a high-quality image, and an image forming apparatus for correcting image shift between exposure heads using the image shift correction method. Background technique [0002] Over the years, as an example of an image recording device, various exposure devices that use a spatial light modulation element (SLM) such as a digital micromirror device (DMD) to perform image exposure with a light beam modulated according to image data have been proposed....

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Problems solved by technology

[0007] Furthermore, the problem with the exposure head is that due to the use of many optical components and mechanical components from the light source to the imaging surface, each component undergoes thermal expansion and thermal contraction as the temperature changes. For each image head of the above image, the offset or overlap generated at the connection point will reach a non-negligible level, resulting in a decrease in image quality

[0009] However, in a multi-head exposure device, the above method is difficult to apply to a multi-head exposure device because the distance between the exposure heads is much smaller than the distance between adjacent beams.

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