Intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate

Abstract

An intermediate substrate comprising: an intermediate substrate body containing an insulating material, and having a first face to be mounted with an semiconductor element and a second face opposing to said first face; and a semiconductor element mounting area including a plurality of first face terminals arranged on said first face, and being surrounded by an outermost periphery of said plurality of first face terminals, wherein a center of said semiconductor element mounting area is eccentric with respect to a center of said first face.

Description

technical field [0001] The present invention relates to an intermediate substrate, an intermediate substrate having a semiconductor element, a substrate having the intermediate substrate, and a structure having the semiconductor element, the intermediate substrate, and the substrate. Background technique [0002] Various structures have appeared in recent years (for example, see JP-A-2000-208661 ( figure 2 (d)) etc.) in which a wiring substrate on which an IC chip is mounted (such as an IC chip mounting substrate or an IC package substrate) and a printed circuit substrate such as a mother board are connected not directly but through a so-called "interposer" The intermediate substrate to connect to each other. [0003] Furthermore, an IC chip to be used in this type of structure is generally formed of a semiconductor material (such as silicon) having a coefficient of thermal expansion of about 2.0 ppm / °C to 5.0 ppm / °C. On the other hand, an intermediate substrate and a wiri...

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Problems solved by technology

[0004] However, there is no structure in which the intermediate substrate is interposed between the IC chip and the IC chip mounting substrate.

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