Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device

Abstract

A manufacturing apparatus of a semiconductor device is provided with a pickup section for picking up a sectioned semiconductor element from a semiconductor wafer, a film sticking section for sticking an element adhesive film sectioned according to a shape of the element to the back surface of the semiconductor element, and an element adhesion section for adhering the semiconductor element to a semiconductor device forming base material. Chippings, which are caused when a thinned semiconductor wafer is diced, are suppressed so to reduce a failure incidence rate of the semiconductor device.

Description

technical field [0001] The present invention relates to a manufacturing method of a semiconductor device and a semiconductor manufacturing apparatus. Background technique [0002] The manufacturing process of a semiconductor device can be roughly divided into a process of forming various element patterns on the surface of a semiconductor wafer (semiconductor substrate), and a process of separating the semiconductor wafer into individual semiconductor elements and packaging the semiconductor elements with a package. In recent years, in order to reduce the manufacturing cost of semiconductor devices, the diameter of wafers has been increased. In addition, semiconductor wafers are being thinned in order to enable high-density mounting of semiconductor elements. [0003] A conventional semiconductor wafer slicing process will be described with reference to FIG. 18 . For example, as described in Patent Document 1 or Patent Document 2, a semiconductor wafer 1 having an element p...

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Problems solved by technology

Therefore, the sticking film causes the edge of the cutting blade to be blocked, which makes the edge dull, which makes the back surface of the semiconductor element prone to large cracks.

Large cracks can be a bad cause of semiconductor elements

[0015] Especially in thinned semiconductor elements, not only the cracks on the back surface are easy to reach the element area, but also the cracks are easy to develop in the subsequent pick-up process and mounting process, which leads to an increase in the defect rate of semiconductor elements

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