RF transceiver module formed in multi-layered ceramic

A radio frequency transceiver module, radio frequency transceiver technology, applied in the direction of electrical components, circuits, transmission systems, etc., can solve the problems of increasing the difficulty of adjusting and correcting radio frequency communication modules, high circuit connection complexity, large circuit area, etc., to achieve low assembly Cost, ease of adjustment and correction, and the effect of fewer circuit parts
CN1578172AInactive Publication Date: 2005-02-09CHI MEI COMM SYST INC
1 Cites 9 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
CHI MEI COMM SYST INC
Publication Date
2005-02-09
Estimated Expiration
Not applicable Β· inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

An RF transceiver module for wireless communication devices includes a multi-layered substrate, an RF transceiver IC mounted on the multi-layered substrate for receiving and transmitting voice or data signals, at least one band selection filter mounted on the multi-layered substrate for filtering received RF signals, an antenna switch integrated in the multi-layered substrate which can be switched to transmit RF signals generated by the power amplifiers to the external antenna or to receive RF signals from an external antenna to the RF transceiver IC through the band selection filter, a plurality of passive devices embedded in the multi-layered substrate, and wiring embedded in the multi-layered substrate for electrically connecting the passive devices, the RF transceiver IC, and the band selection filter.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention provides a radio frequency transceiver module, in particular to a radio frequency transceiver module formed of multilayer ceramics and having a radio frequency transceiver integrated circuit (Integrated Circuit, IC). Background technique

[0002] Radio Frequency (RF) communication modules are usually used in wireless communication devices such as mobile phones. The radio frequency communication module can send and receive wireless signals through multiple frequency bands, among which the radio frequency communication module with dual frequency and triple frequency is the most common. Please refer to figure 1 , figure 1 It is a functional block diagram of the radio frequency communication module 10 of a conventional wireless communication device. The radio frequency communication module 10 includes an antenna switch (antenna switch) 12 , a plurality of surface acoustic wave (Surface Acoustic Wave, SAW) filters 14 and a receiver (receive...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More