Test structure for a single-sided buried strap dram memory cell data array

一种存储单元、测试结构的技术,应用在信息存储、静态存储器、数字存储器信息等方向,能够解决未曾发展任何个别DRMA存储单元等问题

Inactive Publication Date: 2005-03-09
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, for the single side buried strap cell concept, the prior art has not developed any test structure for individual DRMA memory cells, especially select transistors, which can be used to easily and correctly identify the DRMA basic cells electronic properties

Method used

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  • Test structure for a single-sided buried strap dram memory cell data array
  • Test structure for a single-sided buried strap dram memory cell data array
  • Test structure for a single-sided buried strap dram memory cell data array

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Embodiment Construction

[0024]The present invention is explained for an array of single-sided buried tape DRAM cells using the example of checkerboard geometry. The individual structures of the DRAM cells in the chip are preferably produced using silicon planar technology, which involves a series of individual actions over the entire surface of the silicon semiconductor wafer and directly using appropriate masking steps to Changes to the silicon substrate formation area. Multiple dynamic memory cells are formed simultaneously in DRMA memory manufacturing. The design of a single DRMA memory cell is briefly described below with reference to FIGS. 1C and 1D.

[0025] DRAM memory notably uses a single transistor cell, the circuit diagram of which is shown in Figure 1C. These single transistor units include a storage capacitor 1 and a selection transistor 2 . In this case, the selection transistor 2 is preferably in the form of a planar field effect transistor and has a source electrode 21 passing curr...

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Abstract

A test structure for determining the electrical properties of a memory cell in a matrix-like cell array constructed on the basis of the single-sided buried strap concept has a connection between internal electrodes in the storage capacitors in two adjacent memory cells in the direction of the row of active regions in order to produce a series circuit. A first selection transistor and a first storage capacitor in a first memory cell and a second selection transistor and a second storage capacitor in a second memory cell, the active regions of the first and second selection transistors not being connected between the first and second selection transistors via a contact-making bit line.

Description

technical field [0001] The present invention relates to a test structure for determining the electronic characteristics of memory cells, especially the electronic characteristics of select transistors in memory cells of single-sides buried strap DRAM memory cell arrays. Background technique [0002] A dynamic random access memory (DRAM) includes an array of storage cells connected in columns via word lines and in rows via bit lines. Data is read from or written to the memory cell due to appropriate wordline and bitline drive. A dynamic memory cell usually includes a select transistor and a storage capacitor. The select transistor is generally a field effect transistor (field effect transistor) of horizontal design and includes two diffusion regions separated by a channel with a gate connected to a character line. One of the diffusion regions of the selection transistor is connected to a bit line, and the other diffusion region is connected to a storage capacitor. Applying...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): G11C29/00G11C29/50H01L23/544H01L31/0328H10B12/00
CPCY10S257/905G11C2029/5002G11C11/401H01L27/10873G11C2029/0403G11C29/50H01L22/34Y10S257/908H01L2924/0002H10B12/05H01L2924/00
InventorV·罗科普夫S·拉辰曼恩S·苏克曼-普雷诺弗A·费尔伯
OwnerINFINEON TECH AG