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Electronic device

A technology of electronic devices and surface acoustic wave devices, applied in the field of electronic devices with surface acoustic wave devices, can solve the problems of heat reduction, welding efficiency, current leakage, productivity or yield reduction, etc.

Inactive Publication Date: 2005-04-27
FUJITSU MEDIA DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the case where the jig 121 supports the flange 101b as described above, and the current flows from one roll electrode 120 to the other roll electrode 120, the current leaks through the jig 121.
This current leakage reduces heat and causes undesirable welding between flange 101b and clamp 121
Reduced heat reduces welding efficiency
Additionally, there are undesired unsoldered areas
As a result, productivity or yield is reduced

Method used

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Experimental program
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Embodiment Construction

[0022] A first embodiment of the present invention will be described below. The first embodiment is a SAW device housing a SAW chip in its package. It should be noted that the first embodiment includes a plurality of electronic components having cavities sealed using a sealing member such as a top cover.

[0023] Figure 3A represents the SAW device 10 according to the first embodiment, Figure 3B is along Figure 3A Sectional view taken along line A-A shown.

[0024] refer to Figure 3A with 3B , the SAW device 10 includes a cavity 2 having an opening on one surface (upper surface) of the package. The SAW chip 110 is mounted in the cavity 2 face up. The upper surface of the SAW chip 110 is called a first main surface. The second main surface opposite to the first main surface is fixed to the bottom of the cavity 2 using an adhesive 116 or the like. Here, the SAW chip means a chip on which a SAW element is provided. The backside of the SAW chip 110 is bonded on the p...

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Abstract

An electronic device having a cavity, which is included in a package, can be sealed with a lid surely and efficiently. A SAW device comprises a SAW chip that is fixed to a plane portion of a stem. A rear surface of the package is hermetically sealed with glass. An opening of a cavity provided on an upper surface of the package is hermetically sealed by a lid with seam welding. Glass is filled to reach the backside of flange of the stem. Such glass prevents the flange from being distorted by the weight of roller electrodes, and keeps the lid and the flange in contact with each other. In addition, the glass serves as a support, and prevents the current from leaking. Therefore, the lid and the flange are sufficiently and surely welded together.

Description

technical field [0001] The present invention relates generally to electronic devices, and more particularly to electronic devices having surface acoustic wave devices. Background technique [0002] In recent years, electronic devices have achieved miniaturization and high performance. With the development of these electronic devices, there is a need to reduce the size and improve the performance of electronic chips included in the electronic devices. As for surface acoustic wave devices (hereinafter referred to as SAWs) employed in electronic devices, there are similar demands including their packaging. SAW devices are used as filters, transversal filters, oscillators, etc. included in electronic devices that transmit and receive electronic waves. [0003] A conventional SAW device includes a SAW chip hermetically sealed in a cavity. The SAW chip includes comb-like electrodes called interdigital transducers (hereinafter abbreviated as IDTs) provided on a piezoelectric mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L21/50H03H9/10H03H9/25
CPCH01L21/50H03H9/0585H03H9/1071H01L2224/48091H01L2224/48472H01L2224/73265H01L2924/16195H01L2924/00014H03H9/25
Inventor 增子真吾市川聪
Owner FUJITSU MEDIA DEVICES