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Image sensor module of camera apparatus and assembling method thereof

An image sensor and camera technology, applied in image communication, instrumentation, installation, etc., can solve the problems of increasing failure rate, difficulty in fixing work, increasing production cost, etc.

Inactive Publication Date: 2005-04-27
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Particles adhere to the lens surface during this time, thereby increasing the failure rate
[0013] In addition, COB, COF, and CSP processes have some limitations in fabricating slimmer image sensors with dense dimensions due to the difficulty of fixing parts in the above processes
Also, the assembly process of the image sensor module is very complicated as different steps are required
In addition, due to the need for different parts, the production cost is increased

Method used

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  • Image sensor module of camera apparatus and assembling method thereof
  • Image sensor module of camera apparatus and assembling method thereof
  • Image sensor module of camera apparatus and assembling method thereof

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Embodiment Construction

[0025] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the following description of the present invention, the same reference symbols are used to designate the same or similar components, and detailed descriptions of known functions and structures incorporated herein are omitted when it may make the subject matter of the present invention rather unclear.

[0026] like Figure 4 As shown in or 5 , the image sensor module of the camera device according to one embodiment of the present invention includes a circuit board part 200 , an image sensor chip 500 , a lens holder 600 and a lens assembly 700 . The bonding portion 201 is applied to the upper surface of the printed circuit board 200 . The circuit pattern 300 and the infrared filter 400 are bonded to the upper surface of the bonding portion 201 at the same time. The image sensor chip 500 is bonded to the lower portion of the printed circuit board 200 thr...

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Abstract

Disclosed are an image sensor module of a camera and an assembling method thereof capable of simultaneously bonding a circuit pattern and an infrared ray filter to an upper surface of a circuit board section. The image sensor module has the circuit board section including a bonding part made of transparent material. The circuit board section has an upper surface onto which the circuit pattern and the infrared ray filter are simultaneously bonded. An image sensor chip is bonded to a lower surface of the circuit board section using a flip chip bonding technique. A lens holder is bonded to the upper surface of the circuit board section using an epoxy bonding process. A lens assembly is bonded to an upper surface of the lens holder using the epoxy bonding process.

Description

[0001] This application claims the priority of the application entitled "Image Sensor Module for Camera Device and Assembly Method Thereof" filed with the Korean Intellectual Property Office on October 23, 2003 and assigned serial number No. 2003-74106, the contents of which incorporated herein by reference. technical field [0002] The invention relates to an image sensor module of a camera device and an assembly method thereof. More particularly, the present invention relates to an image sensor module of a camera device and an assembling method thereof, in which a circuit pattern and an infrared filter are simultaneously attached to a printed circuit board when assembling the image sensor module of the camera device. Background technique [0003] Image pickup devices are provided in various electronic devices for recognizing images. Such an image pickup device is called a "camera lens module". The camera lens module includes a camera lens. The electronic devices include...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/14G02B7/02G03B30/00H01L23/00H01L27/146H04N23/90H04N25/00
CPCH04N5/2253H04N23/54H01L27/146H01L23/00
Inventor 金相镐李永燮李都炯李铉周
Owner SAMSUNG ELECTRONICS CO LTD