Method of noncontact dispensing of viscous material

A viscous material, non-contact technology, used in devices for applying liquid to surfaces, coatings, printed circuit manufacturing, etc., can solve problems such as excessive thermal pressure, erosion, etc., to reduce production costs and product costs, reduce size , the effect of reducing the number of allocation cycles
CN1612675AInactive Publication Date: 2005-05-04NORDSON CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NORDSON CORP
Publication Date
2005-05-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method of noncontact dispensing a viscous material onto a surface of a substrate, which uses a jetting valve having a nozzle directing the viscous material flow in a jetting direction nonperpendicular to the surface of the substrate. The nonperpendicular jetting direction results in the droplet producing a reduced wetted area on the substrate.
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Description

technical field

[0001] The present invention relates generally to dispensing of viscous materials, and more particularly, to methods of non-contact dispensing of droplets of viscous materials. Background technique

[0002] In the manufacture of substrates, such as printed circuit boards ("PC"), it is often desirable to apply very small amounts of viscous materials, ie, those with viscosities greater than 50 centipoise. Such materials include, by way of example but not limitation, general purpose adhesives, solder pastes, fluxes, solder masks, greases, oils, sealants, potting compounds, epoxies, die attach pastes, silicones , RTV and cyanoacrylate adhesives.

[0003] In the quest for ever-increasing miniaturization of circuits, a fabrication process known as flip-chip has developed that has multiple processes that require dispensing of viscous fluids. For example, if Figure 8 As shown, a device 39, eg, a semiconductor wafer or chip, is attached to a substrate, such as a PC...

Claims

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