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Method for flattening tin ball and fixture

A solder ball and fixture technology, applied in the field of solder ball leveling methods and fixtures, can solve problems such as difficulty, difficulty in setting environmental conditions, and complexity

Inactive Publication Date: 2005-06-15
STARLINK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its disadvantages include: if the process temperature is too high, the circuit board will be deformed at too high a temperature; It is too difficult to set the environmental conditions and other problems. In this case, it is much more complicated and difficult to make a consistent and flat tin layer.

Method used

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  • Method for flattening tin ball and fixture
  • Method for flattening tin ball and fixture
  • Method for flattening tin ball and fixture

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Embodiment Construction

[0010] The aforementioned and other technical content, features and effects of the present invention will be clearly understood in the following detailed description of two preferred embodiments with accompanying drawings.

[0011] Such as figure 2 , 3 shows the first preferred embodiment of the solder ball leveling method of the present invention, including a base 1, a leveling device 2 on the base 1, a clamp 3 on the base 1, And a displacement generating device 4 capable of relative displacement of the clamp 3 and the leveling device 2 .

[0012] The base 1 has a bottom plate 11 and an accommodating portion 12 fixed above the bottom plate 11 . The leveling device 2 has a platform 21 erected at the center of the accommodating portion 12, and a rough surface 22 laid on the platform 21. In this preferred embodiment, the material of the rough surface 22 is diamond sandpaper, and the rough surface 22 has The first side 221 facing upwards.

[0013] The displacement generating ...

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PUM

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Abstract

The method and test fixture utilized to flatten multiple tin balls assembled on an electronic component uses a smoothing unit and a clamp. The smoothing unit possesses first face capable of smoothing these tin balls contacted. The clamp is capable of making electronic elements attach to second face of clamp. Interval between first face and second face is in a prearranged distance. The method includes following steps: clipping an electronic component on the clamp, and making clamp close to smoothing unit relatively. Smoothing operation is carried out for tin balls by using smoothing unit in order to smooth these tin balls to a prearranged distance.

Description

technical field [0001] The invention relates to a solder ball leveling method and fixture, in particular to a solder ball leveling method and fixture capable of leveling multiple solder balls of an electronic component to a predetermined distance. Background technique [0002] With the development of electronic products towards miniaturization, the pin pitch of electronic components made of SMT (Surface Mount Technology) surface mount technology is continuously shrinking, and the number of I / Os is increasing, which makes many difficulties in circuit assembly and production. Therefore, a high-density assembly method has emerged to overcome the above-mentioned problems. Such as figure 1 As shown, it is an electrical connector 9 made in the form of a ball grid array (BGA) body. A plurality of solder balls 91 are distributed under the body 92 in the form of an array of circular solder dots. However, the bottom surfaces of these solder balls 91 must be coplanar to form a flat a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/488H05K3/34
Inventor 林容辉游南辉
Owner STARLINK
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