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Method and device for contactless treatment of flat objects in through type treatment equipment

A processing equipment and non-contact technology, which is applied in the field of non-contact processing of flat objects and devices in pass-through processing equipment, and can solve problems such as helplessness and pressure difference that cannot function

Inactive Publication Date: 2005-07-13
HOLLMULLER MASCHENBAU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For blind holes, Bernoulli's theorem does not help the exchange of matter, because the pressure difference on the two sides of the object cannot play a role

Method used

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  • Method and device for contactless treatment of flat objects in through type treatment equipment
  • Method and device for contactless treatment of flat objects in through type treatment equipment
  • Method and device for contactless treatment of flat objects in through type treatment equipment

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Experimental program
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Effect test

Embodiment Construction

[0019] figure 1 In it, driven transport rollers 2 with axis 4 transport objects 1 to be processed in transport direction 3 . The transport rollers 2 grip the object 1 only at the two edges that do not belong to the effective area of ​​the object. As a result, objects with more sensitive surfaces can also be produced. More and more thin and very thin objects are also treated wet-chemically and / or electrolytically. In circuit board technology, the thickness d of the conductive film is 50 μm or less. If the core of the circuit film is made of polyamide, for example, it can have a particularly high flexibility and be particularly sensitive on the surface. This makes conveying through wet chemical pass-through processing equipment significantly more difficult.

[0020] In circuit films of precision circuit technology, it is additionally required to maintain dimensional accuracy. The tensile force is only allowed to act on the circuit film to a limited extent. During transpor...

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PUM

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Abstract

The present invention relates to the conveying and processing of circuit boards and circuit films, wherein the conveying is horizontal in wet chemical pass-through processing equipment. The slightly inclined conveyor rollers grip the object at the edge and tension it during conveying. In the case of thin circuit films, the required stretching tensions for an uninterrupted transport can be so great that the dimensional accuracy necessary for precision circuit technology is lost. According to the invention, the required delivery reliability is achieved with a moderate stretching tension by means of an electrolyte flow ( 8 ) directed mirror-symmetrically to the object ( 1 ) in the delivery direction ( 3 ). For circuit boards with blind vias, an additional flow of electrolyte (11) is directed mirror-symmetrically close to vertically at the object (1). In order to realize the flow through the additional through-holes, a static pressure difference according to Bernoulli's theorem develops in the electrolyte on both sides of the body.

Description

technical field [0001] The invention relates to a method and a device for the contactless conveyance and treatment of flat objects with horizontal conveying in a pass-through treatment plant. The present invention is preferably used for the wet chemical and electrolytic treatment of circuit boards and possibly also very thin circuit films (circuit sheets). In circuit board technology, such treatments involve, for example, cleaning and etching of surfaces, removal of drilling shavings from holes, plated-through holes, electrolytic strengthening of electrically conductive layers and structures, development of conductor tracks, Stripping (Strippen) and etching, and surface oxidation and reduction and other treatment processes. The size of structures and holes in precision circuit boards is getting smaller and smaller. Conductor lines and distances can be as wide as 25µm or less. For example, in the starting layer, the thickness of the copper layer on the surface is 4 μm. This...

Claims

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Application Information

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IPC IPC(8): B65G13/00B05B1/20B65G49/00C25D5/08C25D7/00C25D7/06H05K1/00H05K3/00H05K3/18
CPCC25D5/08C25D7/0621C25D7/0685H05K1/0393H05K3/0085H05K3/0088H05K2203/0746H05K2203/1509
Inventor T·科西科夫斯基
Owner HOLLMULLER MASCHENBAU
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