Low temperature sealing method of chip for glass matrix micro analysis

A micro-analysis and chip technology, applied in the field of analysis and control chip sealing, can solve the problems of difficult to master processing technology, large investment in processing equipment, easy to block chip channels, etc., to achieve good sealing effect, high sealing success rate, and easy operation. The effect of simple and easy process

Inactive Publication Date: 2005-08-17
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a low-temperature sealing method for glass matrix chips for the above problems o

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Clean the etched chip substrate and cover sheet with acetone, detergent, high-speed water flow (10-20m / s), and absolute ethanol in order to clean the organic matter, solid particles and dust on the chip surface. Take out the chip and dry it with a hair dryer, then soak it in concentrated sulfuric acid or water for 8-12 hours. Then take out the base piece and the cover piece, rinse with high-speed water for 5 minutes, and then attach the two glass pieces tightly. Heat the chip with a 1.2 kilowatt hair dryer (temperature 80-100 ° C, the outlet is perpendicular to the chip, 1 cm away from the chip surface) for 15-20 minutes to complete the chip sealing operation.

[0018] The chip sealed in this embodiment has stronger sealing strength, the shear strength of the chip after sealing can exceed the level of 70 Newton / square centimeter, and the high voltage resistance exceeds the electric field strength of 1000 volts / cm, which can meet the conventional requirements. Requireme...

Embodiment 2

[0020] Clean the etched chip substrate and cover sheet with acetone, detergent, high-speed water flow (10-20m / s), and absolute ethanol in order to clean the organic matter, solid particles and dust on the chip surface. Take out the chip and dry it with a hair dryer, then soak it in concentrated sulfuric acid or water for 8-12 hours. Then take out the base piece and the cover piece, rinse with high-speed water for 5 minutes, and then attach the two glass pieces tightly. Place it at room temperature (15-35° C.) under ventilated conditions for 3 hours to 24 hours to complete the chip sealing operation.

Embodiment 3

[0022] Put the glass chip sealed by the method of Example 1 and Example 2 into a program-controlled high-temperature furnace and heat it at 400-600°C for 1-5 hours to complete the high-temperature permanent sealing of the chip without adding weight to the chip during heating Clamp the block to apply sealing pressure.

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Abstract

The present invention relates to the low temperature packing method of glass substrate chip, and features that in the condition of existing hydrated layer in the packed surface of the micro analysis chip with glass substrate and in the ambiance of low temperature (40-200 deg.c) or room temperature (0-40 deg.c), the micro analysis chip with glass substrate is packed through low temperature heating or simple setting. The present invention has the advantages of simple and feasible technological process, low temperature or room temperature packing, and packing performance reaching the requirement of conventional electrophoretic separation experiment.

Description

technical field [0001] The field that the present invention relates to is the sealing method of analysis and control chip, especially the low-temperature sealing method of glass matrix micro-analysis chip. Background technique [0002] Usually, glass chip processing is mainly divided into two stages: channel etching and chip sealing. Channel etching mostly adopts photolithography process and wet etching technology. Regarding the sealing of glass chips, the most published method is the method of high-temperature sealing, that is, the use of program-controlled heating technology to achieve permanent sealing of chips, and the sealing temperature is usually as high as 500-650°C (Harrison, D.J.; Manz , A.et al.Anal.Chem.1992,64,1926-1932; Jacobson, S.C.; Hergenrder, R.et al.Anal.Chem.1994,66,1107-1113; Yin, X.F.et al.Chinese J. Anal. Chem. 2003, 31, 116-119.). The current problems of this method are: complex operation, difficult to master, need special equipment such as progr...

Claims

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Application Information

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IPC IPC(8): C03C27/00C03C27/06
Inventor 方群贾志舰方肇伦
Owner ZHEJIANG UNIV
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