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Multi-sequenced contacts from single lead frame

A lead frame and the technology of the lead are applied in the assembly/disassembly of contacts, the connection of four or more poles, the protective grounding/shielding device of connecting parts, etc., which can solve the problems of increased product cost and the like

Inactive Publication Date: 2005-09-28
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, twenty-seven leadframes required additional stamping, tooling and assembly, resulting in higher product costs

Method used

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  • Multi-sequenced contacts from single lead frame
  • Multi-sequenced contacts from single lead frame
  • Multi-sequenced contacts from single lead frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] figure 1 A leadframe strip 10 is shown with a plurality of header leadframe elements 14, 16 and 18 formed in accordance with one embodiment of the present invention. A set of header leadframe elements includes header leadframe elements 14 , 16 and 18 . The header leadframe elements 14 , 16 and 18 are integrally formed with the carrier strip 12 of the leadframe strip 10 during the stamping or machining process. The same sets of plug leadframe elements 14, 16 and 18 are also formed. The leadframe strip 10 includes a carrier strip 12 which is connected to the header leadframe elements 14 , 16 and 18 at disconnect points 13 , respectively. Break point 13 may be perforated or otherwise frangible to facilitate removal of header leadframe elements 14 , 16 and 18 from carrier bar 12 .

[0024] The header leadframe element 14 includes a widened portion 28 that is integrally formed with and at right angles to the terminal block transition portion 34 . The header leadframe ele...

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PUM

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Abstract

An electrical connector assembly comprising a housing having an interior chamber defining at least one lead frame plane, and identical sets of non-identical lead frame elements. The lead frame plane has a reference point. The lead frame elements are mounted in the interior chamber and aligned within at least one lead frame plane. The lead frame elements are adjustable along the lead frame plane between multiple levels with respect to the reference point. The multiple mating levels of the lead frame elements are created from only one lead frame. The mating levels are selected by the individual lead frame elements being positioned with respect to the reference point. The electrical connector also comprises N lead frame elements, each of which is adjustable between M mating levels to form X lead frame configurations, wherein X=MN.

Description

technical field [0001] The present invention relates to an electronic connector having contacts arranged for sequential electrical connection when the connector is mated with a mating electronic connector. Background technique [0002] Various electronic systems, such as computers, include a large number of components mounted on printed circuit boards, such as daughter card boards and motherboards, which are connected to each other to transfer signals and power throughout the system. These circuit boards are connected by electronic connectors. Typical connector assemblies include plug connectors and receptacle connectors, each of which can accommodate multiple electrical contacts or dies. An electronic die can be a thin printed circuit board or a series of stacked contacts within a plastic carrier. Electronic chips within one connector may enable a daughterboard to communicate with another daughterboard through the backplane. Additionally, to eliminate the need for a back...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R24/00H01R13/648H01R43/20H01R107/00
CPCH01R43/20H01R12/7088H01R12/725
Inventor 约翰·B·布朗史蒂文·A·韦勒
Owner TE CONNECTIVITY CORP