Method of manufacturing substrate having resist film

Abstract

While keeping the thickness of a resist coated film 21a to a specified thickness, a solution surface height H, a hair-small gap distance T, and a relative scanning speed V of a coating nozzle 22 and a coated surface 10a are adjusted to an adjustable extent, thus broadening a coating gap G. Thus, it can make a coated film's thickness distribution small and improve the thickness uniformity of a resist film formed by coated resist, while keeping the coated film's thickness to a specified thickness, when coating a resist, using a coater commonly known as a 'CAP coater'.

Description

technical field [0001] The present invention relates to a method for manufacturing a substrate with a resist film by coating a resist on a substrate to form a resist film, for example, a method for manufacturing a substrate with a resist film for manufacturing a photomask or the like. Background technique [0002] Conventionally, a method for producing a substrate with a resist film has been proposed, in which a resist such as a photoresist is applied to form a resist film on a substrate such as a silicon wafer (wafer) to form a resist film on the substrate to Used in the manufacture of substrates with resist films. And, as a device for performing coating of such a resist, a coating device (coater) has been proposed. [0003] A so-called spin coater is known as a conventional coating device. The spin coater drips a liquid resist onto the center of the coated surface of a horizontally supported substrate, and then rotates the substrate at high speed in a horizontal plane to...

AI Technical Summary

Problems solved by technology

[0012] However, even with the above-mentioned coating device generally called "CAP coater", when the pattern formed on the substrate is to be made more precise, the thickness uniformity of the resist film may not be sufficient.

[0013] However, conventionally, no studies have been conducted on whether it is possible to form a coating film with a smaller film thickness distribution and to improve the uniformity of the thickness of the resist film in the case of coating a resist using such a coating apparatus.

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