Dry thermal interface material

Abstract

A thermal interface material including a compound which has high thermal conductivity, is dry-to-the-touch, but naturally tacky, and may be formed into various shapes, such as sheets and blocks, to serve as a heat transfer material for electronic components. The compound includes a pre-blend of a polyol ester and an antioxidant, a filler(s), a high viscosity oil, and either a solvent, a surfactant, and a polystyrene-based polymer, or aluminum silicate. A method for using the compound includes the steps of providing a heat generating electronic component with a first surface; providing a heat dissipating component with a second surface with which the first surface is to interface; and disposing the compound between the respective surfaces to effectuate efficient heat transfer therebetween. Further, the compound can be applied alone, e.g., layered, sprayed, or screen printed, can be applied to a thermally conductive foil backing, or a thermally conductive and electrically insulative backing, or formed into shapes such as blocks or sheets. Also, removable liners can be applied to exposed surfaces of the compound to facilitate handling, shipping and storage, but are removed prior to the compound being applied between the electronic component and the heat sink.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation-in-part of US Application Serial No. 09 / 661,729, filed September 14, 2000, entitled "Dry Thermal Grease," which is currently under review. technical field [0003] The present invention relates to thermal transfer materials, and more particularly the present invention relates to dry thermal interface materials, and to methods of making and applying the materials between electronic components and heat sinks. Background technique [0004] In the manufacture of electronic assemblies, a plurality of electronic components are typically combined on a substrate, such as a printed circuit board. In order for these components to operate properly and reliably over time, the heat generated by the components must be efficiently and reliably transferred from the components to the circuit board, which acts as a heat sink. [0005] As such electronic components are made smaller and run faster, they...

AI Technical Summary

Problems solved by technology

Thermal grease has excellent properties over these grease substitutes, including, most notably, the lowest thermal resistance, but is very messy and laborious to apply

[0017] While the aforementioned prior art addresses some of the inherent problems in the field of heat transfer, the prior art still does not disclose or teach the most effective composites and their associated methods of manufacture and use