Dry thermal interface material

A thermal interface material and sheet technology, applied in heat exchange materials, heat transfer modification, heat exchange equipment, etc., can solve problems such as easy to stain, laborious, undisclosed or taught composite manufacturing methods and uses
CN1697870AInactive Publication Date: 2005-11-16AOS THERMAL COMPOUNDS
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
AOS THERMAL COMPOUNDS
Publication Date
2005-11-16
Estimated Expiration
Not applicable ยท inactive patent
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Abstract

A thermal interface material including a compound which has high thermal conductivity, is dry-to-the-touch, but naturally tacky, and may be formed into various shapes, such as sheets and blocks, to serve as a heat transfer material for electronic components. The compound includes a pre-blend of a polyol ester and an antioxidant, a filler(s), a high viscosity oil, and either a solvent, a surfactant, and a polystyrene-based polymer, or aluminum silicate. A method for using the compound includes the steps of providing a heat generating electronic component with a first surface; providing a heat dissipating component with a second surface with which the first surface is to interface; and disposing the compound between the respective surfaces to effectuate efficient heat transfer therebetween. Further, the compound can be applied alone, e.g., layered, sprayed, or screen printed, can be applied to a thermally conductive foil backing, or a thermally conductive and electrically insulative backing, or formed into shapes such as blocks or sheets. Also, removable liners can be applied to exposed surfaces of the compound to facilitate handling, shipping and storage, but are removed prior to the compound being applied between the electronic component and the heat sink.
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Description

[0001] Cross References to Related Applications

[0002] This application is a continuation-in-part of US Application Serial No. 09 / 661,729, filed September 14, 2000, entitled "Dry Thermal Grease," which is currently under review. technical field

[0003] The present invention relates to thermal transfer materials, and more particularly the present invention relates to dry thermal interface materials, and to methods of making and applying the materials between electronic components and heat sinks. Background technique

[0004] In the manufacture of electronic assemblies, a plurality of electronic components are typically combined on a substrate, such as a printed circuit board. In order for these components to operate properly and reliably over time, the heat generated by the components must be efficiently and reliably transferred from the components to the circuit board, which acts as a heat sink.

[0005] As such electronic components are made smaller and run faster, they...

Claims

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