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Multiple sensor integrated chip

An integrated chip, multi-sensor technology, applied in instruments, measuring devices, etc., can solve the problems of large size and heavy weight of multi-sensors, and achieve the effect of solving mutual interference, light weight and small size

Inactive Publication Date: 2006-01-04
XI AN JIAOTONG UNIV
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Problems solved by technology

[0003] The purpose of the present invention is to solve the shortcomings of traditional multi-sensors that are too large and heavy, and provide a MEMS integrated multi-sensor chip based on SOI technology that integrates temperature, pressure, acceleration and humidity sensors. Lightweight, strong anti-interference ability and multi-functional characteristics

Method used

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Embodiment Construction

[0017] The structural principle and working principle of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] see Figure 1 ~ Figure 3 , the multi-sensor integrated chip of the present invention, this chip utilizes the silicon wafer of SOI technology to make, comprises silicon film 1, the supporting silicon substrate 2 of silicon film periphery, silicon cantilever beam 3, the silicon mass block 4 of periphery and glass substrate 5. The silicon membrane and its surrounding supporting silicon base and glass base are anodically bonded to form a relatively independent vacuum chamber 6 as the reference pressure of the absolute pressure sensor, which is deformed by the pressure difference between the external air pressure and the vacuum chamber acting on the silicon membrane. Measure the external pressure. At the same time, four silicon cantilever beams 3 are respectively fixed at one end on the periphery of the supporting ...

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Abstract

The multiple sensor chip integrated based on SOI technology includes silicon cantilever beam, silicon film, supporting silicon base around the silicon film, peripheral silicon mass block and glass substrate. The silicon film, the supporting silicon base and the glass substrate form the relatively independent vacuum environment as the pressure sensor inside the silicon chip; the silicon cantilever beam structure is connected to the peripheral silicon mass block to form the 3D speed sensor; and on the peripheral silicon mass block, there are integrated humidity sensor and temperature sensor. The present invention integrates several sensors on the same chip to solve the problem of mutual interference and result in small size and light weight, and may find its important application in various fields.

Description

technical field [0001] The invention relates to a sensor chip, in particular to a multi-sensor integrated chip integrating temperature, pressure, humidity and acceleration based on SOI technology. Background technique [0002] At present, with the continuous deepening of MEMS research and the continuous maturity and improvement of its technology, there are already very mature technical methods at home and abroad to research and manufacture separation devices and sensors based on MEMS technology, including pressure sensors, accelerometers, humidity and temperature. Each independent sensor, including the sensor, has a good research foundation and representative products. When a single device is used as a sensor measurement element, it plays a huge role in certain application fields and occasions. However, in some specific research and application fields such as aerospace, military industry, automobile, and mobile phone industry, due to volume, weight an...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02
Inventor 赵玉龙蒋庄德徐敬波周建发孙剑
Owner XI AN JIAOTONG UNIV
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