Exposure apparatus and method for producing device

Abstract

An exposure apparatus which performs an exposure while filling a space between a projection optical system and a substrate with a liquid, and in which deterioration of a device caused by adherent liquid on the substrate is suppressed is provided. A device manufacturing system (SYS) includes a main body of an exposure apparatus (EX) which fills a space between a projection optical system (PL) and a substrate (P)with a liquid (50) and projects an image of a pattern onto the substrate (P) via the projection optical system (PL) and the liquid (50); an interface section (IF) which is arranged between the exposure apparatus main body (EX) and a coater/developer main body (C/D) which processes the substrate (P) after exposure; and a liquid-removing unit (100) which removes the liquid (50) adhering to the substrate (P) before the exposed substrate (P) is transferred into the coater/developer main body (C/D) through the interface section (IF).

Description

technical field [0001] The present invention relates to an exposure device for exposing a substrate by filling at least a portion between a projection optical system and a substrate with a liquid, using a pattern image projected by the projection optical system, a liquid removal device used in the exposure device, and an exposure device using the exposure device. Device fabrication methods. Background technique [0002] A semiconductor device or a liquid crystal display device is manufactured by a method called photolithography in which a pattern formed on a mask is transferred to a photosensitive substrate. The exposure apparatus used in this photolithography process has a mask stage that supports the mask and a substrate stage that supports the substrate. While moving the mask stage and the substrate stage one by one, the pattern of the mask is projected through the projection optical system. Transfer to substrate. In recent years, in order to cope with higher integratio...

AI Technical Summary

Problems solved by technology

If the transfer is carried out with the remaining liquid attached to the substrate, the liquid will fall from the substrate during the transfer, and the devices or components around the transfer path will be rusted by the dropped liquid, and the arrangement cannot be maintained. Defects such as the cleanliness of the device environment will occur

Or, there is a case where the environment around the exposure device changes (humidity change) due to the dropped liquid

If the humidity changes, for example, there will be fluctuations in the air on the optical path of the optical interferometer used in the stage position measurement, and the stage position measurement will not be performed with good accuracy, and the desired pattern transfer accuracy will not be obtained. questions like

In addition, if, for example, a development process is performed with the liquid attached to the substrate after the exposure process, there is a possibility that a device with desired performance cannot be manufactured.

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