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PCB method and apparatus for producing landless interconnects

A technology of electrical interconnection and connection, applied in the direction of electrical connection of printed components, printed circuits, printed circuit manufacturing, etc., can solve the problems of high time consumption of metal pads, complicated crowding problems, and increased diameter of through holes.

Inactive Publication Date: 2010-11-03
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Including metal pads on the PCB significantly increases the diameter of each via and further complicates the crowding issue
In addition, forming metal pads is time consuming and expensive

Method used

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  • PCB method and apparatus for producing landless interconnects
  • PCB method and apparatus for producing landless interconnects
  • PCB method and apparatus for producing landless interconnects

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] refer to figure 1 with 2 , the electronic assembly 10 includes a PCB 12, a computer processor 14, a computer processor package 16, a plurality of openings 18, 18A, and 18B, at least one electrical assembly 33, a card edge connector 34, and a plurality of traces 20, 32 , 36, 38 and 42.

[0039] Such as figure 2 As shown in , PCB 12 is a multi-layer substrate formed of dielectric material. The substrate includes an upper layer portion 26 and a lower layer portion 28 . The first trace 32 is formed on the upper surface of the lower portion 28 and is covered by the upper portion 26 . Opening 18 is formed through upper surface 21 of upper layer portion 26 and extends to first trace 32 such that a portion of first trace 32 is exposed. The second elongate trace 20 is formed on the upper surface 21 of the upper layer portion 26 . A portion of the second elongated trace 20 is located within the opening 18 to contact an exposed portion of the first elongated trace 32 throug...

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PUM

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Abstract

An electronic assembly (10) is disclosed. The electronic assembly (10) includes a lower portion (28) and a first elongate trace (32) formed on an upper surface of the lower portion (28). The trace (32) is covered by an upper portion (26), and an opening (18) formed through an upper surface of the upper portion (26) extends to the trace (32) to expose a portion of the trace (32). A second elongatetrace (20) is formed on the upper portion (26). A portion of the second elongate trace (20) positioned in the opening (18) formed through the upper surface of the upper portion (26) contacts the first elongate trace (32) through the opening (18) to form an electrical interconnection (46) between the first trace (32) and the second trace (20).

Description

technical field [0001] The present invention relates generally to printed circuit boards and to the manufacture of printed circuit boards. Background technique [0002] A computer typically has electronic components including a printed circuit board (PCB) and a processor chip mounted to the PCB. Electrical components on different layers of the PCB are connected through generally cylindrical openings called vias, which are formed through one or more layers of the PCB. The interior of each opening is lined with copper or other conductive material. Metal lands formed on one or more layers of the PCB contact the conductive linings of the vias and are connected to the electrical components of the PCB by metal traces extending between the metal lands and the electrical components. Without the metal pads, it is difficult, if not impossible, to make the necessary electrical connections. [0003] The conventional method described above is disadvantageous because forming vias consu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/11
CPCH05K2201/09545H05K3/4644H05K2201/09827H05K2201/09518H05K1/115H05K2201/09645H05K2201/09245Y10T29/49126
Inventor D·博格斯D·萨托J·敦甘G·佩克
Owner INTEL CORP