Laser processing method

A laser processing method and pulsed laser technology, which are used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems that laser grooves cannot be effectively formed, and the laser beam cannot be set at the bottom of the laser grooves.
CN1733415AInactive Publication Date: 2006-02-15DISCO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DISCO CORP
Publication Date
2006-02-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

A laser processing method for forming a laser groove along dividing lines by applying a pulse laser beam along the dividing lines formed on a workpiece, the method comprising the steps of forming the focusing spot of the pulse laser beam in a shape of oval, positioning the long axis of the oval focusing spot along each of the dividing lines, and moving the focusing spot and the workpiece along the dividing line relative to each other.
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Description

field of invention

[0001] The present invention relates to a method of performing laser processing along dividing lines called "streets" formed on a workpiece such as a semiconductor wafer. Background technique

[0002] In the production process of semiconductor devices, a plurality of regions are divided by dividing lines called "streets" provided in a grid pattern on the front surface of a substantially disk-shaped semiconductor wafer, and each divided Circuits (functional elements) such as ICs or LSIs are formed in the area. Individual semiconductor chips are manufactured by dicing the semiconductor wafer along dividing lines so as to divide it into regions on which circuits are formed. It is also possible to cut an optical device wafer including a light-receiving element (a plurality of functional elements) such as a photodiode or a light-emitting element (a plurality of functional elements) such as a laser diode laminated on the front surface of a sapphire substrate al...

Claims

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