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Chip type carrying paper board for taking in electronic element

An electronic component and chip-type technology, applied in the field of carrier cardboard for chip-type electronic component storage, can solve problems such as inability to adequately cope with changes in shape and size, achieve the effect of preventing poor insertion and removal, and improving operability

Active Publication Date: 2006-04-05
OJI PAPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, none of the above-mentioned methods can adequately cope with changes in the shape and size of the recesses caused by changes in the temperature and humidity of the operating environment, and therefore cannot sufficiently prevent the occurrence of chip insertion failures and removal failures caused by environmental changes.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Manufacture three-layer paperboard with surface layer, middle layer and back layer. At this time, the pulp for the surface layer was mixed and beaten with 30% by mass of coniferous kraft pulp A and 70% by mass of hardwood sun-dried kraft pulp using a double-moving disc refiner, and prepared into CSF ​​(Canadian Standard Freeness) 460ml. What the paper pulp used in the middle layer is to utilize a double-moving disc refiner to mix and beat conifer kraft pulp A10 mass % and broad-leaved tree sun-dried kraft pulp B90 mass %, and be modulated into the material of CSF (Canadian Standard Freeness) 410ml; the back layer As for the pulp, the sun-dried kraft pulp of broad-leaved trees was used alone and was beaten with a double-moving disc refiner and adjusted to a CSF (Canadian Standard Freeness) of 470 ml. Aluminum sulfate was added to each pulp at a ratio of 2.0% by mass relative to the mass of the pulp; as a sizing agent, 0.50% by mass of SIZEPAIN N-771 (trademark, produced ...

Embodiment 2

[0049] A carrier cardboard for housing chip-type electronic components was manufactured in the same manner as in Example 1, and provided for a mounting test. However, in the manufacture of three-layer paperboard, for the pulp for the surface layer, use a double-moving disc refiner to separately mix and beat the hardwood kraft pulp B to prepare a material with a CSF (Canadian Standard Freeness) of 460ml; For the pulp used in the layer, use a double-moving disc refiner to separately mix and beat hardwood sun-dried kraft pulp B to prepare a material with a CSF (Canadian Standard Freeness) of 410ml; for the pulp for the back layer, use a double-moving disc refiner to separately beat Hardwood Sun Kraft Pulp B to CSF ​​(Canadian Standard Freeness) 470ml material. The results are represented in Table 1.

Embodiment 3

[0051] A carrier cardboard for housing chip-type electronic components was manufactured in the same manner as in Example 1, and provided for a mounting test. However, when making a three-layer paperboard, for the pulp used in the surface layer, use a double-moving disc refiner to beat hardwood kraft pulp B separately, and adjust it into a material with a CSF (Canadian Standard Freeness) of 430ml; for the pulp used in the middle layer , use a double-moving disc refiner to beat hardwood sun-dried kraft pulp B separately, and adjust it into a material with a CSF (Canadian Standard Freeness) of 410ml; CSF (Canadian Standard Freeness) 430ml of material. Record the results in Table 1.

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PUM

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Abstract

The invention provides a bearing cardboard used for receiving an element, which can not generate or hardly generate a concave hole for receiving a chip electronic element that generates the dimension change according to the change of the environmental condition. The bearing cardboard is made by a plurality of layers of vat cardboards, on the basis of the conditions of 23 DEG C, 50 % RH and 24 hours, the dimension change rate of the concave hole in the bearing cardboard is controlled to the MD direction dimension change rate which is equal to or below 5.5 percent and the CD direction dimension change rate which is equal to or below 11.0 percent under the conditions of 60 DEG C, 90%RH and 24 hours.

Description

technical field [0001] The present invention relates to a carrier cardboard made of paper for housing chip-type electronic components. More specifically, the present invention relates to a carrier cardboard for storing chip-type electronic components that does not or rarely causes poor insertion and removal of chip-type electronic components due to changes in environmental temperature and humidity, and is excellent in workability. Background technique [0002] The carrier cardboard for chip-type electronic component storage is a carrier (storage and holding member) for chip-type electronic components, and is usually produced by subjecting the cardboard for carrier cardboard to the following processing. [0003] (1) The cardboard for carrier cardboard is divided|segmented into the strip shape of predetermined width. [0004] (2) Form square holes and circular holes of a predetermined size in the obtained cardboard strip. The square holes are used to store chip-type electron...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02B65D85/86B65D65/38D21H27/00
CPCB65D73/02
Inventor 山本学奥谷岳人田平久美手岛伊久朗
Owner OJI PAPER CO LTD