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Polishing composition

A kind of polishing composition, technology of water-soluble polymer, applied in the field of polishing composition

Inactive Publication Date: 2006-05-03
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polishing compositions in the above-mentioned patent applications No. 4-313224 and No. 11-302634 do not fully satisfy the required performance, so there is still room for improvement for the polishing compositions

Method used

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Examples

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Embodiment Construction

[0007] An embodiment of the present invention will now be described.

[0008] The polishing composition according to the present embodiment includes an abrasive, a polishing accelerator, and water.

[0009] The abrasive contains at least colloidal silica. The role of colloidal silica is to mechanically polish objects.

[0010] Colloidal silica having an average particle size of secondary particles of less than 10 nm does not have a high ability to polish objects. Therefore, the average particle size of the colloidal silica secondary particles is preferably 10 nm or more from the viewpoint of improving the polishing rate. Meanwhile, when the average particle size of the colloidal silica secondary particles is greater than 60nm, or particularly greater than 40nm, or particularly further greater than 30nm, the filter will be clogged and needs to be replaced frequently. Therefore, the average particle size of the colloidal silica secondary particles is preferably 60 nm or less,...

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PUM

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Abstract

A polishing composition comprising colloidal silicon dioxide, potassium hydroxide, potassium bicarbonate, and water, wherein the content of colloidal silicon dioxide in the polishing composition is 2 mass% or more. The colloidal silica secondary particles contained in the polishing composition have an average particle size of 60 nm or less. The polishing composition is suitable for polishing semiconductor substrates.

Description

technical field [0001] The present invention relates to a polishing composition for polishing an object such as a semiconductor substrate. Background technique [0002] A polishing composition containing colloidal silica has been proposed for polishing semiconductor substrates such as silicon wafers. However, this type of polish composition can be problematic due to the negative effects caused by colloidal silica flocculation. For example, many surface defects occur on a semiconductor substrate polished using the polishing composition, and a filter for removing polishing debris in the polishing composition after polishing is easily clogged due to recycling of the polishing composition. The polishing compositions disclosed in Japanese Patent Application Nos. 4-313224 and 11-302634 are improved to prevent this negative effect. However, the polishing compositions in the above-mentioned Patent Application Nos. 4-313224 and 11-302634 do not suffi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24B37/00C09G1/02H01L21/304H01L21/306
CPCC09G1/02H01L21/02024C09K3/14
Inventor 上村泰英
Owner FUJIMI INCORPORATED
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