Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Integrated circuit design for routing an electrical connection

An integrated circuit and electrical connection technology, applied in the implementation field of interpolation of virtual conductive segments, can solve the problems of time-consuming and expensive, and achieve the effect of saving manufacturing costs and design change time

Active Publication Date: 2006-05-10
TAIWAN SEMICON MFG CO LTD
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can be an expensive and time-consuming endeavor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated circuit design for routing an electrical connection
  • Integrated circuit design for routing an electrical connection
  • Integrated circuit design for routing an electrical connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The present invention discloses a solution for replacing the above existing dummy conductive pads by using a first group of dummy conductive segments on a first metal layer and a second group of dummy conductive segments on a second metal layer. The first group and the second group of dummy conductive segments are arranged in a staggered manner. An inter-level dielectric layer is interposed between the first metal layer and the second metal layer. A plurality of interconnection units are formed on the dielectric interlayer for selectively connecting the first conductive segment and the second conductive segment, thereby forming a link path between a first node and a second node . When there is a change in the design, rerouting can be achieved by changing the arrangement of the above-mentioned interconnection units, without changing the dummy conductive segments below or above. This minimizes the number of reticles that need to be changed and simplifies the rerouting p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention relates to one integration circuit and its electrically filtering method, which comprises one virtual set metal layer with one first set of sparse order and one second metal layer with one second set sparse order. The first set and second set cross with vertical overlap area to connect their vertical overlapped areas through first virtual conductive sections and one set order combination for providing one set linkage path between first set joint and second selected one of two virtually conductive section. The integration circuit and its selecting method can save process cost and design altering time.

Description

technical field [0001] The present invention relates to an integrated circuit (IC) layout design, and more particularly to an implementation of interleaved dummy conductive segments for simplifying rerouting of electrical connections . Background technique [0002] With the advancement of semiconductor technology, the shrinking device size and increasingly complex circuit design have made the design and manufacture of integrated circuits more difficult. Circuit complexity and device density often lead to design errors, such as electronic circuit errors, violation of layout rules, pattern congestion, timing errors, noise, crosstalk, and so on. In order to correct these errors, engineering change orders (ECOs) will require redesigning the integrated circuits. One typical ECO is the rerouting of an electrical connection between a first node and a second node within an integrated circuit. Electrical connections typically consist of multiple metal lines on many different metal...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/52H01L21/768H01L21/82H01L27/00
CPCH01L23/525H01L27/0203H01L2924/0002H01L2924/00
Inventor 郑嘉麟胡顶达鲁立忠
Owner TAIWAN SEMICON MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products