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Encapsulating composition for LED

A sealing composition and composition technology, applied in coatings, semiconductor devices, electrical components, etc., can solve problems such as failure to provide mechanical strength, breakage and deformation of LED connection lines

Inactive Publication Date: 2006-07-05
WACKER CHEM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The polysiloxanes having organosiloxane units reported in the above prior art have excellent transparency and provide sufficient elasticity to absorb shocks, but still have a tendency to deform, sometimes causing breakage of the LED connection lines, and cannot provide resiliency. Fully satisfactory mechanical strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 5

[0094] For each example, the ingredients were mixed in the amounts shown in Table 1 in a cylindrical aluminum vessel with a diameter of 5 cm, followed by thorough stirring. Then 200 ppm of platinum catalyst on a platinum metal equivalent basis was added and the mixture was thoroughly stirred again. The container was then heated in an oven at a temperature of 200°C for 5 hours. Following cooling to room temperature, the samples were removed from the oven and various measurements and evaluations were made. The refractive index of the samples of Examples 1 to 4 was measured, and the result was 1.50 in Example 1 and 1.51 in Example 4. Compared with the refractive index of epoxy resin, the above-mentioned refractive index results are quite excellent. The results of other evaluations are shown in Table 1.

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Abstract

An organopolysiloxane composition which cures to a resinous solid has high strength, transparency, and resistance to thermal- and photo-degradation, and is especially suited for encapsulating LEDs. The composition contains specific addition curable organopolysiloxanes having D, T, and Q units, and a proportion of silicon-bonded aromatic groups.

Description

technical field [0001] The present invention relates to a polyorganosiloxane composition for sealing light-emitting diodes (hereinafter referred to as LED), more particularly to a polyorganosiloxane composition which becomes a resinous material by curing, which is suitable for sealing LEDs that emit light in the blue to ultraviolet range as well as components that emit white light. Background technique [0002] LEDs have many favorable properties, including long life, high brightness, low voltage, small size, almost complete absence of thermal radiation, free modulation of light emission and fast-acting switching, maintaining good luminous efficiency (even at low temperatures) and Into the adaptability of waterproof structure, and the potential use of LED is constantly expanding. [0003] Among various applications of LEDs, the development of LEDs that emit light in the blue to ultraviolet wavelength range has been called an important reason for the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K3/10C09D183/04C08G77/04H01L33/00
CPCC08G77/70C08G77/80H01L33/56C08L83/04C09D183/04C08G77/16C08G77/20C08G77/12C08L83/00C08K3/10
Inventor 中泽桂一
Owner WACKER CHEM GMBH
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