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Cross fluid flow pin-rib array minisize heat exchanger

A heat exchanger and array technology, applied in the field of microelectronics, can solve problems such as uneven temperature distribution and large temperature changes on the heat exchange surface

Inactive Publication Date: 2006-07-19
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are two design limitations of the microchannel heat sink
First, due to the large flow resistance caused by the small size; second, due to the large temperature change of the cooling medium between the inlet and the outlet, resulting in uneven temperature distribution on the heat exchange surface

Method used

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  • Cross fluid flow pin-rib array minisize heat exchanger
  • Cross fluid flow pin-rib array minisize heat exchanger
  • Cross fluid flow pin-rib array minisize heat exchanger

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as image 3 As shown, the semiconductor laser bar 17 is cooled by a fluid-sweeping pin-fin array miniature heat exchanger. The length, width, and thickness of a typical semiconductor laser bar 17 are 10000×1000×115 microns, and several of them are uniformly arranged The laser emitter, the fluid-sweeping pin-fin array micro heat exchanger 16 consists of figure 1 The flow guide plate 1 shown, the flow guide plate 2, the flow guide plate 3, and the heat transfer plate 4 are welded in sequence, each piece is rectangular, and the width is the same as the length of the semiconductor laser bar 17, and the semiconductor laser bar 17 Fixed on the heat transfer sheet 4, the circular pin-fin array 15 in a row is composed of three groups of 72 circular pin fins with a diameter of 300 microns, and the height of the pin fins is half the thickness of the heat transfer sheet 4, which is 300 microns. The needle ribs are arranged in a row. There are three inlet slots 12 and four o...

Embodiment 2

[0033] Such as Figure 4 As shown, the pin fin array 15 on the heat transfer sheet 4 is arranged in a fork row. The entire pin fin array 18 is composed of three groups of 66 circular pin fins with a diameter of 300 microns. Half of the thickness is 300 microns. The thickness of the flow guide sheet 1 , the flow guide sheet 2 , and the flow guide sheet 3 are all 300 microns, and the thickness of the heat transfer sheet 4 is 600 microns. A closed fluid circulation can be formed inside the fluid-sweeping pin-fin array micro heat exchanger. The fluid flow sequence is: fluid inlet 5, fluid inlet 8, fluid inlet 10, inflow channel 14, inflow slot 12, fork row circular Pin fin array 15 , outflow slot 13 , outflow channel 7 , diversion bridge 11 , fluid outlet 9 and fluid outlet 6 . After the cooling fluid enters through the inflow slot 12, it will be divided into two paths and flow along the direction parallel to the heat transfer surface, passing across the fork-row circular pin-fi...

Embodiment 3

[0035] Such as Figure 5 As shown, the pin-fin array 15 on the heat transfer sheet 4 is arranged in a row, and the whole pin-fin array 15 consists of three groups with a total of 72 cross-sections that are square (300×300 microns 2 ), the height of the pin rib is half of the thickness of the heat transfer sheet 4, which is 300 microns. The thickness of the flow guide sheet 1 , the flow guide sheet 2 , and the flow guide sheet 3 are all 300 microns, and the thickness of the heat transfer sheet 4 is 600 microns. A closed fluid circulation can be formed inside the fluid-sweeping pin-fin array micro heat exchanger. The order of fluid flow is: fluid inlet 5, fluid inlet 8, fluid inlet 10, inflow channel 14, inflow slit 12, square needles along the row Rib array 15 , outflow slit 13 , outflow channel 7 , diversion bridge 11 , fluid outlet 9 and fluid outlet 6 . After the cooling fluid enters through the inflow slit 12, it will be divided into two paths and flow along the direction...

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Abstract

The invention relates to a fluid transverse needle array micro heat exchanger, belonging to the micro electric technique, which relates to a cooling device. Said inventive device comprises layered flowing plate (1), outlet guide plate (2), inlet guide plate (3) and heat conductive plate (4). Wherein, the flowing plate has a fluid inlet (5) and outlet (6) connected to the external pipeline; the outlet guide plate has an outlet channel, a fluid inlet (8) and a outlet (9); the part of inlet guide plate (3) that relative to the fluid inlet (5) of flowing plate has a fluid inlet (10), a guide bridge (11), a inlet slit (12) and a outlet slit (13); the heat conductive plate ha a inlet channel (14) and a needle rib array (15). The invention is based on the fluid transverse needle array conversion heat exchange theory, which can improve eth surface heat radiation and improve the uniformity of temperature distribution of cooled surface.

Description

Technical field: [0001] The invention belongs to the technical field of microelectronics and relates to a cooling device. Background technique: [0002] With the continuous development of industrial technology, all kinds of electronic products are developing in the direction of small size, light weight and high heat flux. Therefore, for the new generation of electronic equipment, the design limit and manufacturing technology of the traditional cooler can no longer meet the requirements. The development of micro-coolers stems from solving the heat dissipation problem of high-speed integrated circuits. At present, it has developed into various high heat flux fields with weight restrictions and volume restrictions, such as aerospace industry, cooling of electronic components, cooling of high-power semiconductor lasers, chemical process heat transfer etc. Its main purpose is to reduce the probability of failure and damage of electronic equipment due to overheating, and at the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/36G12B15/06
Inventor 夏国栋
Owner BEIJING UNIV OF TECH
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